Semiconductor device and method of manufacturing the same

ABSTRACT

A method of manufacturing a semiconductor device includes providing a semiconductor substrate, forming, over a main surface the semiconductor substrate, a first insulating film, forming, over the first insulating film, an Al-containing conductive film containing aluminum as a main component, patterning the Al-containing conductive film to form a pad, forming, over the first insulating film, a second insulating film to cover the pad therewith, forming an opening in the second insulating film, and electrically coupling a copper wire to the pad exposed from the opening.

The present application is a Divisional Application of U.S. patentapplication Ser. No. 14/792,461, filed on Jul. 6, 2015, which is basedon and claims priority from Japanese Patent Application No. 2014-141591,filed on Jul. 9, 2014, and Japanese Patent Application No. 2015-104883,filed on May 22, 2015, the entire contents of which are incorporatedherein by reference.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a semiconductor device and a method ofmanufacturing the same and can be used appropriately for a semiconductordevice having, e.g., a pad and a method of manufacturing the same.

BACKGROUND OF THE INVENTION

A semiconductor device is manufactured by forming a semiconductorelement such as a MISFET in a semiconductor substrate, forming amultilayer wiring structure having a plurality of wiring layers over thesemiconductor substrate, and forming a passivation film in the uppermostlayer thereof. The semiconductor device has a pad for wire bonding. Thepad is exposed from an opening provided in the passivation film.Examples of a wire coupled to the pad include a gold wire and a copperwire.

Japanese Unexamined Patent Publication No. 2013-4781 (Patent Document 1)describes a technique related to a semiconductor device which can beelectrically coupled using a bonding wire containing copper as a maincomponent.

Japanese Unexamined Patent Publication No. 2002-76051 (Patent Document2) describes a technique related to a bonding pad structure in asemiconductor device.

Japanese Unexamined Patent Publication No. Hei 9(1997)-74097 (PatentDocument 3) describes a technique related to a method of forming abarrier metal.

SUMMARY OF THE INVENTION

In a semiconductor device having a pad also, it is desired to maximallyimprove the performance thereof.

Other problems and novel features of the present invention will becomeapparent from a statement in the present specification and theaccompanying drawings.

Further, when a temperature variation ratio of any of the plurality ofresistance components and the electrostatic capacity components islarge, it is difficult to maintain a constant time constant over theentire range of an assumed temperature range for the display to be usedand it is hard to ensure reliability of the display.

According to an embodiment, in a semiconductor device having a pad towhich a copper wire is to be electrically coupled, the pad includes anAl-containing conductive film containing aluminum as a main component.In a region to which the copper wire is to be coupled, a first laminatedfilm including a first conductor film, and a second conductor film overthe first conductor film is formed over the Al-containing conductivefilm. The second conductor film is in an uppermost layer. The firstconductor film is a single-layer film or a laminated film including oneor more layers of films selected from the group consisting of a titaniumfilm, a titanium nitride film, a tantalum film, a tantalum nitride film,a tungsten film, a tungsten nitride film, a titanium-tungsten film, anda tantalum-tungsten film. The second conductor film is made of one ormore metals selected from the group consisting of palladium, gold,ruthenium, rhodium, platinum, and iridium.

According to the embodiment, a semiconductor device includes asemiconductor chip having a pad, a copper wire electrically coupled tothe pad of the semiconductor chip, and a sealing resin portion sealingtherein the semiconductor chip, and the copper wire. The pad includes anAl-containing conductive film containing aluminum as a main component.Between the copper wire and the Al-containing conductive film, a firstlaminated film including a first conductor film, and a second conductorfilm over the first conductor film is interposed. The copper wire isbonded to the second conductor film. The first conductor film is asingle-layer film or a laminated film including one or more layers offilms selected from the group consisting of a titanium film, a titaniumnitride film, a tantalum film, a tantalum nitride film, a tungsten film,a tungsten nitride film, a titanium-tungsten film, and atantalum-tungsten film. The second conductor film is made of one or moremetals selected from the group consisting of palladium, gold, ruthenium,rhodium, platinum, and iridium.

According to the embodiment, a method of manufacturing a semiconductordevice includes the steps of: (a) providing a semiconductor substrate;(b) forming, over a main surface the semiconductor substrate, a firstinsulating film; and (c) forming, over the first insulating film, anAl-containing conductive film containing aluminum as a main component.The method of manufacturing the semiconductor device further includesthe steps of: (d) patterning the Al-containing conductive film to form apad; (e) forming, over the first insulating film, a second insulatingfilm so as to cover the pad therewith; (f) forming an opening in thesecond insulating film; and (g) electrically coupling a copper wire tothe pad exposed from the opening. The method of manufacturing thesemiconductor device further includes the steps of: (h) after the step(c) and before the step (g), forming a first conductor film over theAl-containing conductive film; and (i) after the step (h) and before thestep (g), forming a second conductor film over the first conductor film.The first conductor film is a single-layer film or a laminated filmincluding one or more layers of films selected from the group consistingof a titanium film, a titanium nitride film, a tantalum film, a tantalumnitride film, a tungsten film, a tungsten nitride film, atitanium-tungsten film, and a tantalum-tungsten film. The secondconductor film is made of one or more metals selected from the groupconsisting of palladium, gold, ruthenium, rhodium, platinum, andiridium.

According to the embodiment, the reliability of the semiconductor devicecan be improved.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is an overall plan view of a semiconductor device in anembodiment;

FIG. 2 is a cross-sectional view showing an example of a semiconductordevice (semiconductor package) obtained by packaging the semiconductordevice (semiconductor chip) in FIG. 1;

FIG. 3 is a cross-sectional view showing another example of thesemiconductor device (semiconductor package) obtained by packaging thesemiconductor device (semiconductor chip) in FIG. 1;

FIG. 4 is a process flow chart showing the manufacturing process of thesemiconductor device shown in FIG. 2;

FIG. 5 is a process flow chart showing the manufacturing process of thesemiconductor device shown in FIG. 3;

FIG. 6 is a main-portion cross-sectional view of the semiconductordevice in the embodiment;

FIG. 7 is a main-portion cross-sectional view of the semiconductordevice in the embodiment;

FIG. 8 is a plan view showing a pad formation region;

FIG. 9 is a cross-sectional view showing a state where a wire iselectrically coupled to the pad shown in FIG. 6;

FIG. 10 is a process flow chart showing a part of the manufacturingprocess of the semiconductor device in the embodiment;

FIG. 11 is a main-portion cross-sectional view of the semiconductordevice in the embodiment during the manufacturing process thereof;

FIG. 12 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 11;

FIG. 13 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 12;

FIG. 14 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 13;

FIG. 15 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 14;

FIG. 16 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 15;

FIG. 17 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 16;

FIG. 18 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 17;

FIG. 19 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 18;

FIG. 20 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 19;

FIG. 21 is a main-portion cross-sectional view of a semiconductor devicein a first studied example;

FIG. 22 is a cross-sectional view showing a state where a copper wire iselectrically coupled to the pad shown in FIG. 21;

FIGS. 23A to 23C are cross-sectional views each showing the vicinity ofa region where the copper wire is coupled to the pad in thesemiconductor device in the first studied example;

FIGS. 24A to 24C are cross-sectional views each showing the vicinity ofa region where the copper wire is coupled to the pad in thesemiconductor device in the embodiment;

FIG. 25 is a main-portion cross-sectional view of a semiconductor devicein a second studied example;

FIG. 26 is a cross-sectional view showing a state where a copper wire iselectrically coupled to the pad shown in FIG. 25;

FIGS. 27A to 27C are cross-sectional views each showing the vicinity ofa region where the copper wire is coupled to the pad in thesemiconductor device in the second studied example;

FIG. 28 is a graph showing the result of a reliability test inaccordance with a high-temperature storage test;

FIG. 29 is a main-portion cross-sectional view of a semiconductor devicein a first modification;

FIG. 30 is a cross-sectional view showing a state where a copper wire iselectrically coupled to the pad shown in FIG. 29;

FIG. 31 is a main-portion cross-sectional view of the semiconductordevice in the first modification during the manufacturing processthereof;

FIG. 32 is a main-portion cross-sectional view of a semiconductor devicein a second modification;

FIG. 33 is a cross-sectional view showing a state where a wire iselectrically coupled to the pad shown in FIG. 32;

FIG. 34 is a main-portion cross-sectional view of the semiconductordevice in the second modification during the manufacturing processthereof;

FIG. 35 is a main-portion cross-sectional view of a semiconductor devicein a third modification during a manufacturing process thereof;

FIG. 36 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 35;

FIG. 37 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 36;

FIG. 38 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 37;

FIG. 39 is a main-portion cross-sectional view of a semiconductor devicein a fourth modification;

FIG. 40 is a main-portion cross-sectional view of a semiconductor devicein another embodiment;

FIG. 41 is a cross-sectional view showing a state where a wire iselectrically coupled to the pad shown in FIG. 40;

FIG. 42 is a main-portion cross-sectional view of a semiconductor devicein a modification of the other embodiment;

FIG. 43 is a cross-sectional view showing a state where a wire iselectrically coupled to the pad shown in FIG. 42;

FIG. 44 is a main-portion cross-sectional view of the semiconductordevice in the other embodiment during the manufacturing process thereof;

FIG. 45 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 44;

FIG. 46 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 45;

FIG. 47 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 46;

FIG. 48 is a main-portion cross-sectional view of the semiconductordevice in the modification of the other embodiment during themanufacturing process thereof;

FIG. 49 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 48;

FIG. 50 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 49;

FIG. 51 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 50;

FIG. 52 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 51;

FIG. 53 is a main-portion cross-sectional view of a semiconductor devicein still another embodiment;

FIG. 54 is a cross-sectional view showing a state where a wire iselectrically coupled to the pad shown in FIG. 53;

FIG. 55 is a main-portion cross-sectional view of the semiconductordevice in the still other embodiment during the manufacturing processthereof;

FIG. 56 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 55;

FIG. 57 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 56;

FIG. 58 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 57;

FIG. 59 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 58;

FIG. 60 is a main-portion cross-sectional view of a semiconductor devicein a modification of the still other embodiment during the manufacturingprocess thereof;

FIG. 61 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 60;

FIG. 62 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 61;

FIG. 63 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 62;

FIG. 64 is a main-portion cross-sectional view of the semiconductordevice during the manufacturing process thereof, which is subsequent toFIG. 63; and

FIG. 65 is an explanatory view of a case in which a nickel film is usedas a barrier conductor film.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS

In the following embodiments, if necessary for the sake of convenience,each of the embodiments will be described by being divided into aplurality of sections or embodiments. However, they are by no meansirrelevant to each other unless particularly explicitly describedotherwise, and one of the sections or embodiments is modifications,details, supplementary explanation, and so forth of part or the whole ofthe others. Also, in the following embodiments, when the number and thelike (including the number, numerical value, amount, range, and thelike) of elements are mentioned, they are not limited to the specifiednumbers unless particularly explicitly described otherwise or unlessthey are obviously limited to specified numbers in principle. The numberand the like of the elements may be not less than or not more than thespecified numbers. Also, in the following embodiments, it goes withoutsaying that the components thereof (including also elements, steps, andthe like) are not necessarily indispensable unless particularlyexplicitly described otherwise or unless the components are consideredto be obviously indispensable in principle. Likewise, if the shapes,positional relationships, and the like of the components and the likeare mentioned in the following embodiments, the shapes, positionalrelationships, and the like are assumed to include those substantiallyproximate or similar thereto and the like unless particularly explicitlydescribed otherwise or unless it can be considered that they obviouslydo not in principle. The same shall apply in regard to the foregoingnumerical value and range.

The embodiments of the present invention will be described below indetail on the basis of the drawings. Note that, throughout all thedrawings for illustrating the embodiments, members having the samefunctions are designated by the same reference numerals, and a repeateddescription thereof is omitted. In the following embodiments, adescription of the same or like parts will not be repeated in principleunless particularly necessary.

In the drawings used in the embodiments, hatching may be omitted even ina cross section for improved clarity of illustration, while even a planview may be hatched for improved clarity of illustration.

First Embodiment

<About Overall Structure of Semiconductor Chip>

Referring to the drawings, a semiconductor device in the presentembodiment will be described.

FIG. 1 is an overall plan view of a semiconductor device (semiconductorchip) CP in the present embodiment. FIG. 1 shows an overall plan view ofthe upper surface side of the semiconductor device CP.

The semiconductor device (semiconductor chip) CP in the presentembodiment has an upper surface as one main surface, and a back surface(lower surface) opposite to the upper surface. FIG. 1 shows the uppersurface of the semiconductor device CP. It is assumed that, in thesemiconductor device CP, the main surface formed with pads PD isreferred to as the upper surface of the semiconductor device CP and themain surface opposite to the main surface (i.e., upper surface) formedwith the pads PD is referred to as the back surface of the semiconductordevice CP.

As shown in FIG. 1, the semiconductor device CP has the plurality ofpads (pad electrodes, electrode pads, or bonding pads) PD on the uppersurface side thereof. The pads PD function as terminals for the externalcoupling of the semiconductor device CP. The pads PD are wire bondingpads. When a semiconductor package or the like is manufactured using thesemiconductor device CP, wires (corresponding to wires WA describedlater) are electrically coupled to the pads PD.

The two-dimensional shape of the semiconductor device CP is aquadrilateral, more specifically a rectangle. However, the cornerportions of the rectangle may also be rounded off. As shown in FIG. 1,at the upper surface of the semiconductor device CP, the plurality ofpads PD are arranged along the outer periphery thereof. In the case inFIG. 1, the plurality of pads PD are arranged (aligned) at the uppersurface of the semiconductor device CP along the fourth sides thereof.However, the arrangement of the pads PD is not limited thereto. Theremay also be a case where the plurality of pads PD are arranged (aligned)along three, two, or one side thereof. In the case in FIG. 1, the padsare aligned in one row, but the alignment of the pads is not limitedthereto. The pads can also be aligned in, e.g., two rows or in astaggered arrangement. Also, the number of the pads PD included in thesemiconductor device CP can be changed as necessary.

<About Semiconductor Package Structure>

FIG. 2 is a cross-sectional view schematically showing an example of asemiconductor device (semiconductor package) PKG obtained by packagingthe semiconductor device (semiconductor chip) CP in the presentembodiment. FIG. 3 is a cross-sectional view showing another example. Itis assumed that the semiconductor device PKG shown in FIG. 2 isdesignated by a reference numeral PKG1 and referred to as asemiconductor device PKG1, and the semiconductor device PKG shown inFIG. 3 is designated by a reference numeral PKG2 and referred to as asemiconductor device PKG2.

The semiconductor device (semiconductor package) PKG1 shown in FIG. 2 isa semiconductor package manufactured using a lead frame. Thesemiconductor device PKG1 has the semiconductor device (semiconductorchip) CP, a die pad (chip mounting portion) DP supporting or mountingthereon the semiconductor device CP, a plurality of leads LD, theplurality of wires (bonding wires) WA electrically coupling theplurality of leads LD to the plurality of pads PD in the upper surfaceof the semiconductor device CP, and a sealing portion MR1 sealingtherein the semiconductor device CP, the die pad DP, the leads LD, thewires WA, and the pads PD.

The sealing portion (resin sealing portion) MR1 is a sealing resinportion and made of a resin material such as, e.g., a thermosettingresin material or the like. The sealing portion MR1 can also contain afiller or the like. By the sealing portion MR1, the semiconductor deviceCP, the plurality of leads LD, and the plurality of wires WA are sealedand electrically and mechanically protected.

The semiconductor device CP is mounted (placed) over the upper surfaceof the die pad DP such that the upper surface of the semiconductordevice CP faces upward. The back surface of the semiconductor device CPis bonded and fixed to the upper surface of the die pad DP via a bondingmaterial (die bond material or adhesive) BD1. The semiconductor deviceCP is sealed in the sealing portion MR1 and is not exposed from thesealing portion MR1.

Each of the leads (lead portions) LD is formed of a conductor andpreferably made of a metal material such as copper (Cu) or a copperalloy. Each of the leads LD includes an inner lead portion as theportion of the lead LD which is located in the sealing portion MR1, andan outer lead portion as the portion of the lead LD which is locatedoutside the sealing portion MR1. The outer lead portion protrudes from aside surface of the sealing portion MR1 to the outside of the sealingportion MR1.

The outer lead portion of each of the leads LD has been subjected tobending such the lower surface of the outer lead portion in the vicinityof the end portion thereof is located slightly below the lower surfaceof the sealing portion MR1. The outer lead portion of the lead LDfunctions as the external terminal of the semiconductor device PKG1.

The individual pads PD in the upper surface of the semiconductor deviceCP are electrically coupled to the respective inner lead portions of theindividual leads LD via the wires (bonding wires) WA each serving as aconductive coupling member. That is, one of the both end portions ofeach of the wires WA is coupled to one of the pads PD of thesemiconductor device CP, while the other end portion thereof is coupledto the upper surface of the inner lead portion of one of the leads LD.Note that, as will be described later in detail, the end portion of thewire WA coupled to the pad PD is actually coupled (bonded) to a metalfilm ME1 described later. Each of the wires WA has electricalconductivity and is specifically a copper (Cu) wire containing copper(Cu) as a main component. The wire WA is sealed in the sealing portionMR1 and is not exposed from the sealing portion MR1.

The semiconductor device (semiconductor package) PKG2 shown in FIG. 3 isa semiconductor package manufactured using a wiring substrate. Thesemiconductor device PKG2 has the semiconductor device (semiconductorchip) CP, a wiring substrate PC mounting (supporting) thereon thesemiconductor device CP, the plurality of wires WA electrically couplingthe plurality of pads PD in the upper surface of the semiconductordevice CP to a plurality of coupling terminals BLD in the wiringsubstrate PC which correspond thereto, and a sealing portion MR2covering the upper surface of the wiring substrate PC including thesemiconductor device CP and the wires WA. The semiconductor device PKG2further has a plurality of solder balls BL which are provided asexternal terminals in an area array arrangement at the lower surface ofthe wiring substrate PC.

The wiring substrate PC has an upper surface and a lower surface as mainsurfaces opposite to each other. The semiconductor device CP is mounted(placed) over the upper surface of the wiring substrate PC such that theupper surface of the semiconductor device CP faces upward. The backsurface of the semiconductor device CP is bonded and fixed to the uppersurface of the wiring substrate PC via a bonding material (die bondmaterial or adjective) BD2. The semiconductor device CP is sealed in thesealing portion MR2 and is not exposed from the sealing portion MR2.

In the upper surface of the wiring substrate PC, the plurality ofcoupling terminals (bonding leads) BLD are provided while, in the lowersurface of the wiring substrate PC, a plurality of conductive lands DLare provided. The plurality of coupling terminals BLD in the uppersurface of the wiring substrate PC are individually electrically coupledto the plurality of conductive lands DL in the lower surface of thewiring substrate PC. The wires of the wiring substrate PC include thewires in the upper surface of the wiring substrate PC, via wires in thewiring substrate PC, internal wires in the wiring substrate PC, and thewires in the lower surface of the wiring substrate PC. To the respectiveconductive lands DL, solder balls BL are coupled (formed) as projectingelectrodes. As a result, at the lower surface of the wiring substratePC, the plurality of solder balls BL are arranged in an arrayconfiguration to be able to function as the external terminals of thesemiconductor device PKG2.

The pads PD in the upper surface of the semiconductor device CP areelectrically coupled to the respective coupling terminals BLD in theupper surface of the wiring substrate PC via wires (bonding wires) WA asconductive coupling members. That is, one of the both end portions ofeach of the wires WA is coupled to one of the pads PD in thesemiconductor device CP, while the other end portion thereof is coupledto one of the coupling terminals BLD. Note that, as will be describedlater in detail, the end portion of the wire WA coupled to the pad PD isactually coupled (bonded) to the metal film ME1 described later. Asdescribed above, the wires WA are copper (Cu) wires each containingcopper (Cu) as a main component. Each of the wires WA is sealed in thesealing portion MR2 and is not exposed from the sealing portion MR2.

Similarly to the foregoing sealing portion MR1, the sealing portion(sealing resin portion) MR2 is a resin sealing portion and made of aresin material such as, e.g., a thermosetting resin material or thelike. The sealing portion MR2 may also contain a filler or the like. Bythe sealing portion MR2, the semiconductor device CP and the pluralityof wires WA are sealed and electrically and mechanically protected.

Next, a description will be given of the manufacturing process of thesemiconductor device PKG1 shown in FIG. 2 and the manufacturing processof the semiconductor device PKG2 shown in FIG. 3. FIG. 4 is a processflow chart showing the manufacturing process of the semiconductor devicePKG1 shown in FIG. 2. FIG. 5 is a process flow chart showing themanufacturing process of the semiconductor device PKG2 shown in FIG. 3.

First, a description will be given of the manufacturing process of thesemiconductor device PKG1 shown in FIG. 2 with reference to FIGS. 2 and4.

To manufacture the semiconductor device PKG1, first, the lead frame andthe semiconductor device (semiconductor chip) CP are provided (Step S1in FIG. 4). The lead frame integrally has a framework, the plurality ofleads LD coupled to the framework, and the die pad DP connected to theframework via a plurality suspension leads. In Step S1, it may bepossible to provide the lead frame first and then provide thesemiconductor device CP, provide the semiconductor device CP first andthen provide the lead frame, or simultaneously provide the lead frameand the semiconductor device CP.

Next, by performing a die bonding step, the semiconductor device CP ismounted over the die pad DP of the lead frame via the bonding materialBD1 and bonded thereto (Step S2 in FIG. 4).

Next, by performing a wire bonding step, the plurality of pads PD of thesemiconductor device CP are individually electrically coupled to theplurality of leads LD (the inner lead portions thereof) of the leadframe via the plurality of wires (bonding wires) WA (Step S3 in FIG. 4).One end portion of each of the wires WA is coupled to one of the pads PD(specifically, the metal film ME1 described later) of the semiconductordevice CP, while the other end portion thereof is coupled to the uppersurface of the inner lead portion of one of the leads LD. In wirebonding, the semiconductor device CP is heated to a predeterminedtemperature.

Next, resin sealing is performed by a mold step (resin molding step) toseal the semiconductor device CP and the plurality of wires WS coupledthereto in the sealing portion (sealing resin portion) MR1 (Step S4 inFIG. 4). By the mold step in Step S4, the sealing portion MR1 sealingtherein the semiconductor device CP, the die pad DP, the inner leadportions of the plurality of leads LD, the plurality of wires WA, andthe suspension leads is formed.

Next, the outer lead portions of the leads LD exposed from the sealingportion MR1 are subjected to plating as necessary. Then, outside thesealing portion MR1, the leads LD and the suspension leads are cut atpredetermined positions to be separated from the framework of the leadframe (Step S5 in FIG. 4).

Next, the outer lead portions of the leads LD protruding from thesealing portion MR1 are subjected to bending (lead processing or leadforming) (Step S6 in FIG. 4).

In this manner, the semiconductor device PKG1 shown in FIG. 2 ismanufactured.

Next, a description will be given of the manufacturing process of thesemiconductor device PKG2 shown in FIG. 3 with reference to FIGS. 3 and5.

To manufacture the semiconductor device PKG2, first, the wiringsubstrate PC and the semiconductor device (semiconductor chip) CP areprovided (Step S11 in FIG. 5). At this stage, a plurality of the wiringsubstrates PC may also be connected integrally in an arrayconfiguration. In Step S11, it may also be possible to provide thewiring substrate PC first and then provide the semiconductor device CP,provide the semiconductor device CP first and then provide the wiringsubstrate PC, or simultaneously provide the wiring substrate PC and thesemiconductor device CP.

Next, by performing a die bonding step, the semiconductor device(semiconductor chip) CP is mounted over the wiring substrate PC via thebonding material BD2 and bonded thereto (Step S12 in FIG. 5).

Next, by performing a wire bonding step, the plurality of pads PD of thesemiconductor device CP are individually electrically coupled to theplurality of coupling terminals BLD of the wiring substrate PC on whichthe semiconductor device CP is mounted via the plurality of wires(bonding wires) WA (Step S13 in FIG. 5). One end portion of each of thewires WS is coupled to one of the pads PD (specifically, the metal wireME1 described later) of the semiconductor device CP, while the other endportion thereof is coupled to one of the coupling terminals BLD. In wirebonding, the semiconductor device CP is heated to a predeterminedtemperature.

Next, resin sealing is performed by a mold step (resin molding step) toform the sealing portion (sealing resin portion) MR2 over the uppersurface of the wiring substrate PC so as to cover the semiconductordevice CP and the wires WS therewith and seal the semiconductor deviceCP and the wires WS in the sealing portion MR2 (Step S14 in FIG. 5).

Next, to the respective conductive lands DL at the lower surface of thewiring substrate PC, the solder balls BL are coupled (Step S15 in FIG.5).

Then, in the case where the plurality of wiring substrates PC areintegrally connected in an array configuration, a wiring mothersubstrate in which the plurality of wiring substrates PC are integrallyconnected in the array configuration is subjected to cutting (dicing) tobe divided into the individual wiring substrates PC (Step S16 in FIG.5). At this time, there may also be a case where the sealing portion MR2is cut together with the wiring mother substrate.

In this manner, the semiconductor device PKG2 shown in FIG. 3 ismanufactured.

<About Internal Structure of Semiconductor Chip>

FIG. 6 is a main-portion cross-sectional view of the semiconductordevice (semiconductor chip) CP in the present embodiment and shows across section traversing the pad PD. Note that, in FIG. 6, theillustration of the structure located below the interlayer insulatingfilm IL6 is omitted.

As shown in FIG. 6, the pad PD is formed over the interlayer insulatingfilm IL6. Over the interlayer insulating film IL6, an insulating film(passivation film) PA is formed so as to cover a part of the pad PD. Thepad PD is partly exposed from an opening OP provided in the insulatingfilm PA. That is, the opening OP is an opening for the pad PD and formedso as to be included in the pad PD in plan view. Accordingly, thetwo-dimensional size (plane area) of the opening OP is smaller than thetwo-dimensional size (plane area) of the pad PD. The pad PD has theportion (i.e., portion overlapping the opening OP in plan view) exposedfrom the opening OP and the portion (i.e., portion not overlapping theopening OP in plan view) covered with the insulating film PA.

The insulating film PA is in the uppermost layer of the semiconductordevice (semiconductor chip) CP and can function as a surface protectivefilm. That is, the insulating film PA is a passivation film. Thetwo-dimensional shape of each of the pad PD and the opening OP is, e.g.,a quadrilateral (more specifically, a square). As the insulating filmPA, a single-layer insulating film or a laminated insulating film inwhich a plurality of insulating films are laminated can be used. Inanother form, it is also possible to further provide another insulatingfilm over the insulating film PA. However, the state where the pad PD ispartly exposed from the opening OP is maintained.

The pad PD is an aluminum pad formed mainly of aluminum (Al).Specifically, the pad PD is formed of a laminated film including abarrier conductor film (barrier conductive film) BR1, an Al-containingconductive film AM1 over the barrier conductor film BR1, and a barrierconductor film (barrier conductive film) BR2 over the Al-containingconductive film AM1. Note that, in the portion of the pad PD which islocated under the insulating film PA, the barrier conductor film BR2 isformed over the Al-containing conductive film AM1. By contrast, in theportion of the pad PD which is exposed from the opening OP of theinsulating film PA, the barrier conductor film BR2 is not formed overthe Al-containing conductive film AM1. This is because the portion ofthe barrier conductor film BR2 which was exposed from the opening OP ofthe insulating film PA has been removed.

The Al-containing conductive film AM1 is a conductive film containing Al(aluminum) and preferably made of a conductive material film (conductivematerial film showing metal conduction) containing aluminum (Al) as amain component (base). As the Al-containing conductive film AM1, analuminum film (pure aluminum film) can be used, but the Al-containingconductive film AM1 is not limited thereto. As the Al-containingconductive film AM1, a compound film or an alloy film containingaluminum (Al) as a main component (base) can also be used. For example,a compound film or an alloy film between Al (aluminum) and Si (silicon),a compound film or an alloy film between Al (aluminum) and Cu (copper),or a compound film or an alloy film between Al (aluminum), Si (silicon),and Cu (copper) can be used appropriately as the Al-containingconductive film AM1. The composition ratio (content) of Al (aluminum) inthe Al-containing conductive film AM1 is higher than 50 at % (i.e., richin Al), or more preferably not less than 98 at %.

Each of the barrier conductor films BR1 and BR2 is a conductive film(preferably conductive film showing metal conduction). Of the barrierconductor films BR1 and BR2, the barrier conductor film BR1 has thefunction of improving adhesion to an underlay (e.g., interlayerinsulating film IL6) and preventing peeling. Accordingly, it isdesirable that the barrier conductor film BR1 has excellent adhesion toan underlay (e.g., interlayer insulating film IL6) and excellentadhesion to the Al-containing conductive film AM1 formed over thebarrier conductor film BR1. As the barrier conductor film BR1, alaminated film including, e.g., a titanium (Ti) film, a titanium nitride(TiN) film, and a titanium (Ti) film which are successively laminated inascending order can be used appropriately. Besides, e.g., a single-layertitanium (Ti) film, a single-layer titanium nitride (TiN) film, alaminated film including a titanium (Ti) film and a titanium nitride(TiN) film, or the like can be used as barrier conductor film BR1.

The barrier conductor film BR2 has the function of improving adhesion tothe insulating film PA and preventing peeling. Accordingly, it isdesirable that the barrier conductor film BR2 has excellent adhesion tothe underlying Al-containing conductive film AM1 and excellent adhesionto the insulating film PA formed over the barrier conductor film BR2.The barrier conductor film BR2 can also function as an antireflectionfilm in a photolithographic step. When the function of the barrierconductor film BR2 as the antireflection film is insufficient, it isalso possible to form a BARC (Bottom Anti-Reflective Coating) under aphotoresist layer (photoresist layer for forming a photoresist patternRP1 described later) in the photolithographic step.

As the barrier conductor film BR1, a titanium nitride (TiN) film can beused appropriately. Besides, e.g., a titanium (Ti) film, a tantalum (Ta)film, a tantalum nitride (TaN) film, a tungsten (W) film, a tungstennitride (WN) film, a titanium-tungsten (TiW) film, or atantalum-tungsten (TaW) film can be used as the barrier conductor filmBR2.

The Al-containing conductive film AM1 can also function as the mainconductor film of the pad PD. The thickness of the Al-containingconductive film AM1 is larger (thicker) than the thickness of each ofthe barrier conductor films BR1 and BR2. Since the pad PD is formedmainly of the Al-containing conductive film AM1, the pad PD can beregarded as an aluminum pad.

Over the inner surface (inner wall) of the opening OP of the insulatingfilm PA including the upper surface of the pad PD exposed from theopening OP of the insulating film PA, a laminated film (laminated filmpattern) LM1 including a barrier conductor film BR3, and the metal filmME1 over the barrier conductor film BR3 is formed. The laminated filmLM1 is formed to extend over the pad PD exposed at the bottom portion ofthe opening OP in the insulating film PA, the side surface (side wall)of the opening OP in the insulating film PA, and the insulating film PAaround the opening OP. The outer periphery of the laminated film LM1 islocated over the insulating film PA around the opening OP. From theportion of the pad PD which is exposed from the opening OP, the barrierconductor film BR2 over the Al-containing conductive film AM1 has beenremoved. Consequently, at the bottom portion of the opening OP of theinsulating film PA, a state is observed where the barrier conductor filmBR3 of the laminated film LM1 is formed over the Al-containingconductive film AM1 of the pad PD (so as to come in contact with theAl-containing conductive film AM1).

What is important is that, over the pad PD (which is the Al-containingconductive film AM1 included in the pad PD) exposed from the opening OPof the insulating film PA, the laminated film LM1 including the barrierconductor film BR3, and the metal film ME1 over the barrier conductorfilm BR3 is formed.

The metal film ME1 is a film (outermost film) with which a copper wire(corresponding to the foregoing wire WA) comes into contact when thecopper wire is electrically coupled to the pad PD by wire bonding. Whenthe top surface of the metal film ME1 is oxidized, the copper wire isless likely to be bonded to the metal film ME1. Accordingly, the metalfilm ME1 is made preferably of a metal resistant to oxidation,particularly preferably of a precious metal. To allow easy bonding ofthe copper wire to the metal film ME1, it is desirable that the frontend portion (ball-shaped front end portion) of the hard copper wireeasily digs into the metal film ME1 to be firmly attached thereto.Therefore, the metal film ME1 is preferably made of a relatively softmetal. To enhance the bonding strength of the copper wire, the metalfilm ME1 is preferably made of a metal which can be bonded to copper(Cu) forming the copper wire and form an intermetallic compound (orsolid solution). Preferably, the intermetallic compound (or solidsolution) resulting from the reaction between the metal film ME1 andcopper (Cu) forming the copper wire is resistant to corrosion. That is,it is desirable to choose a material for the metal film ME1 such that,even in such a high-temperature environment as in a high-temperaturestorage test, an intermetallic compound (or solid solution) susceptibleto corrosion is not generated by the reaction between the metal film ME1and copper (Cu) forming the copper wire.

Note that halogen ions such as Cl (chlorine) ions or Br (bromine) ions(or a halide such as chloride or bromide), sulfate ions containing S(sulfur) (or sulfide), or the like may be contained in a sealing resin(corresponding to the foregoing sealing portion MR1 or MR2).Accordingly, it is desirable to choose a material for the metal film ME1such that an intermetallic compound (or solid solution) which issusceptible to corrosion by such ions (or compounds) as may be containedin the sealing resin is not generated by the reaction between the metalfilm ME1 and copper (Cu) forming the copper wire. In the case in each offirst and second studied examples described later, when ahigh-temperature storage test is performed, an intermetallic compoundwhich is susceptible to such ions (or compound) as may be contained inthe sealing resin is formed in the vicinity of the region to which thecopper wire is bonded. Consequently, defective bonding of the copperwire is likely to occur.

In view of these features, the metal film ME1 is made of one or moremetals selected from the group consisting of palladium (Pd), gold (Au),ruthenium (Ru), rhodium (Rh), platinum (Pt), and iridium (Ir).Accordingly, as the metal film ME1, a palladium film (Pd), a gold film(Au), a ruthenium film (Ru), a rhodium film (Rh), a platinum film (Pt),or an iridium film (Ir) can be used. However, as the metal film ME1, analloy film made of two or more metals selected from the group consistingof palladium (Pd), gold (Au), ruthenium (Ru), rhodium (Rh), platinum(Pt), and iridium (Ir) can also be used. Most preferably, the metal filmME1 is a palladium (Pd) film.

By using a palladium (Pd) film as the metal film ME1, the strength ofbonding of the copper wire to the metal film ME1 is easily enhanced. Inthe case where the copper wire is coupled to the palladium film as themetal film ME1, even when the semiconductor chip CP is stored at a hightemperature for a long time, an intermetallic compound (i.e., Pd—Cuintermetallic compound) formed between the palladium film and the copperwire is less likely to grow due to the low growth speed thereof and thestate of bonding of the copper wire is less likely to be changed.Therefore, even when the semiconductor chip CP is stored at a hightemperature for a long time, the strength of bonding to the metal filmME1 is easily maintained. As a result, when a high-temperature storagetest is performed, defective coupling of the copper wire is less likelyto occur. Accordingly, to maximally improve the coupling reliability ofthe copper wire, the palladium (Pd) film is most preferably used as themetal film ME1.

The barrier conductor film BR3 is preferably made of a material whichenhances the adhesion (adhesiveness) thereof to the metal film ME1formed over the barrier conductor film BR3. The barrier conductor filmBR3 is also preferably made of a material which enhances the adhesion(adhesiveness) thereof to an underlying film (which is the Al-containingconductive film AM1 herein). The barrier conductor film BR3 is alsopreferably made of a material which can prevent aluminum (Al) formingthe Al-containing conductive film AM1 from being diffused through thebarrier conductor film BR3 into the metal film ME1. The barrierconductor film BR3 is also preferably made of a material which canprevent copper (Cu) forming the wire WA from being diffused through thebarrier conductor film BR3 into the Al-containing conductive film AM1.That is, the barrier conductor film BR3 is preferably made of a materialwhich can prevent the diffusion of Al forming the Al-containingconductive film AM1 and prevent Al forming the Al-containing conductivefilm AM1 from reacting with Cu forming the copper wire even when placedin a high-temperature environment such as in a high-temperature storagetest. The barrier conductor film BR3 is also preferably made of amaterial which is less likely to be bonded to aluminum (Al) forming theAl-containing conductive film AM1 and form an intermetallic compound (orsolid solution).

In view of these features, the barrier conductor film BR3 is asingle-layer film or a laminated film including one or more layers offilms selected from the group consisting of a titanium (Ti) film, atitanium nitride (TiN) film, a tantalum (Ta) film, a tantalum nitride(TaN) film, a tungsten (W) film, a tungsten nitride (WN) film, atitanium-tungsten (TiW) film, and a tantalum-tungsten (TaW) film.

Preferably, the barrier conductor film BR3 includes a titanium (Ti) filmand the metal film ME1 is formed over the titanium (Ti) film. Mostpreferably, the barrier conductor film BR3 is a titanium (Ti) film. Atitanium film has an excellent barrier property (diffusion preventingfunction) against Al as well as excellent adhesion to a palladium film.Accordingly, a palladium film as the metal film ME1 is preferably formedover a titanium film (so as to come in contact with the titanium film).

Therefore, as a combination of the barrier conductor film BR3 and themetal film ME1, a combination of a titanium (Ti) serving as the barrierconductor film BR3 and a palladium (Pd) film serving as the metal filmME1 is most preferred. The combination not only is adequate from theviewpoint described above, but also particularly increases the adhesionbetween the barrier conductor film BR3 and the metal film ME1 and allowseasy processing.

Next, a cross-sectional structure of the semiconductor device CPincluding the structure located below the interlayer insulating film IL6will be described with reference to FIGS. 7 and 8.

FIG. 7 is a main-portion cross-sectional view of the semiconductordevice (semiconductor chip) CP in the present embodiment. FIG. 7 shows across section of the semiconductor device including the structurelocated below the interlayer insulating film IL6 shown in FIG. 6. FIG. 8is a plan view showing a region where the pad PD is formed. The pad PDshown in the cross-sectional view of FIG. 7 substantially corresponds toa cross-sectional view taken at the position along the line A-A in FIG.8. Note that, since FIG. 6 described above is a cross-sectional viewtaken at a position where an opening SH is not traversed, the opening SHand a via portion V5 are not shown.

In the semiconductor device CP in the present embodiment, semiconductorelements such as MISFETs are formed in the main surface of thesemiconductor substrate SB and, over the semiconductor substrate SB, amultilayer wiring structure including a plurality of wiring layers isformed. A specific description will be given below of an example of aconfiguration of the semiconductor device in the present embodiment.

As shown in FIG. 7, in the semiconductor substrate SB made ofmonocrystalline silicon or the like and included in the semiconductordevice in the present embodiment, semiconductor elements such as MISFETs(Metal Insulator Semiconductor Field Effect Transistors) are formed. Inthe semiconductor substrate SB, a plurality of MISFETs are formed, butFIG. 7 shows two MISFETs (which are an n-channel MISFET Qn and ap-channel MISFET Qp) as the representatives of the plurality of MISFETs.

In the main surface of the semiconductor substrate SB, isolation regionsST are formed by a STI (Shallow Trench Isolation) method or the like. Inthe active regions of the semiconductor substrate SB which are definedby the isolation regions ST, the MISFETs (Qn and Qp) are formed. Theisolation regions ST are each made of an insulating film embedded in atrench formed in the semiconductor substrate SB.

In the semiconductor substrate SB, a p-type well PW and an n-type wellNW are formed. Over the p-type well PW, a gate electrode GE1 for then-channel MISFET Qn is formed via a gate insulating film GF. Over then-type well NW, a gate electrode GE2 for the p-channel MISFET Qp isformed via the gate insulating film GF. Each of the gate insulatingfilms GF is made of, e.g., a silicon dioxide film or the like. Each ofthe gate electrodes GE1 and GE2 is made of, e.g., a polycrystallinesilicon film into which an impurity has been introduced.

In the p-type well PW of the semiconductor substrate SB, n-typesemiconductor regions NS for the source/drain of the n-channel MISFET Qnare formed. In the n-type well NW of the semiconductor substrate SB,p-type semiconductor regions PS for the source/drain of the p-channelMISFET Qp are formed. The gate electrode GE11, the gate insulating filmGF under the gate electrode GE1, and the n-type semiconductor regions NS(source/drain regions) on both sides of the gate electrode GE1 form then-channel MISFET Qn. On the other hand, the gate electrode GE2, the gateinsulating film GF under the gate electrode GE2, and the p-typesemiconductor regions PS (source/drain regions) on both sides of thegate electrode GE2 form the p-channel MISFET Qp. Each of the n-typesemiconductor regions NS and the p-type semiconductor regions PS canalso have an LDD (Lightly doped Drain) structure. In this case, over theside walls of the gate electrodes GE1 and GE2, side-wall insulatingfilms referred to also as sidewall spacers are formed. It may also bepossible to form metal silicide layers (not shown) in the respectiveupper portions of the n-type semiconductor regions NS, the p-typesemiconductor regions PS, and the gate electrodes GE1 and GE2 using asalicide (Self Aligned Silicide) technique.

In the description given herein, the MISFETs are used as an example ofthe semiconductor elements formed in the semiconductor substrate SB.However, it may also be possible to additionally form a capacitorelement, a resistor element, a memory element, a transistor havinganother configuration, or the like.

Also, in the description given herein, the monocrystalline siliconsubstrate is used as an example of the semiconductor substrate SB.However, in another form, a SOI (Silicon On Insulator) substrate or thelike can also be used as the semiconductor substrate SB.

Over the semiconductor substrate SB, a plurality of interlayerinsulating films and a plurality of wiring layers form a multilayerwiring structure.

That is, over the semiconductor substrate SB, a plurality of interlayerinsulating films IL1, IL2, IL3, IL4, and IL5 are formed. In theplurality of interlayer insulating films IL1, IL2, IL3, IL4, and IL5,plugs V1, via portions V2, V3, and V4, and wires M1, M2, M3, and M4 areformed. Over the interlayer insulating film IL5, the interlayerinsulating film IL6 is formed. Over the interlayer insulating film IL6,the pad PD is formed. Note that, over the interlayer insulating filmIL6, wires (not shown) in the same layer as that of the pad PD can alsobe formed.

Specifically, over the semiconductor substrate SB, the interlayerinsulating film IL1 is formed so as to cover the foregoing MISFETs (Qnand Qp). In the interlayer insulating film IL1, the plugs V1 areembedded. Over the interlayer insulating film IL1 in which the plugs V1are embedded, the interlayer insulating film IL2 is formed. In theinterlayer insulating film IL2, the wires M1 are embedded. Over theinterlayer insulating film IL2 in which the wires M1 are embedded, theinterlayer insulating film IL3 is formed. In the interlayer insulatingfilm IL3, the wires M2 are embedded. Over the interlayer insulating filmIL3 in which the wires M2 are embedded, the interlayer insulating filmIL4 is formed. In the interlayer insulating film IL4, the wires M3 areembedded. Over the interlayer insulating film IL4 in which the wires M3are embedded, the interlayer insulating film IL5 is formed. In theinterlayer insulating film IL5, the wires M4 are embedded. Over theinterlayer insulating film IL5 in which the wires M4 are embedded, theinterlayer insulating film IL6 is formed. Over the interlayer insulatingfilm IL6, the pad PD is formed. Each of the interlayer insulating filmsIL1 to IL6 can be a single-layer insulating film (e.g., a silicondioxide film) or a laminated film including a plurality of insulatingfilms. Over the interlayer insulating film IL6, the insulating film PAis formed so as to cover the pad PD. In the insulating film PA, theopening OP partly exposing the pad PD is formed. As has been describedabove with reference to FIG. 6 and as also shown in FIG. 7, over theinner surface (inner wall) of the opening OP of the insulating film PAincluding the upper surface of the pad PD exposed from the opening OP ofthe insulating film PA, the laminated film LM1 including the barrierconductor film BR3, and the metal film ME1 thereover is formed.

The plugs V1 are made of a conductor and disposed under the wires M1.The plugs V1 electrically couple the wires M1 to various semiconductorregions formed in the semiconductor substrate SB, the gate electrodesGE1 and GE2, and the like.

The via portions V2 are made of a conductor and integrally formed withthe wires M2. The via portions V2 are placed between the wires M2 and M1to electrically couple the wires M2 and M1 to each other. That is, inthe interlayer insulating film IL3, using a dual damascene method, thewires M2 and the via portions V2 integrally formed with the wires M2 areembedded. In another embodiment, it is also possible to separately formthe via portions V2 and the wires M2 using a single damascene method.The same applies also to the via portions V3, V4, and V5.

The via portions V3 are made of a conductor and formed integrally withthe wires M3. The via portions V3 are placed between the wires M3 and M2to electrically couple the wires M3 and M2 to each other. That is, inthe interlayer insulating film IL4, using a dual damascene method, thewires M3 and the via portions V3 formed integrally with the wires M3 areembedded.

The via portions V4 are made of a conductor and formed integrally withthe wires M4. The via portions V4 are placed between the wires M4 and M3to electrically couple the wires M4 and M3 to each other. That is, inthe interlayer insulating film IL5, the wires M4 and the via portions V4formed integrally with the wires M4 are embedded.

The wires M1, M2, M3, and M4 have been illustrated and describedheretofore as damascene wires (embedded wires) formed by a damascenemethod, but are not limited thereto. The wires M1, M2, M3, and M4 canalso be formed by patterning conductor films for wires. For example, thewires M1, M2, M3, and M4 can also be aluminum wires.

In the interlayer insulating film IL6, the opening (through hole orthrough bore) SH is formed at a position overlapping the pad PD in planview. In the opening SH, the via portion V5 is formed (embedded). Thevia portion V5 is made of a conductor and placed between the pad PD andthe wire M4 to electrically couple the pad PD and the wire M4 to eachother. That is, in the interlayer insulating film IL6, using a singledamascene method, the via portion V5 is embedded.

Note that, in the present embodiment, the via portion V5 and the pad PDare separately formed. However, in another embodiment, the via portionV5 can also be formed integrally with the pad PD. When the via portionV5 is formed integrally with the pad PD, a part of the pad PD isembedded in the opening SH of the interlayer insulating film IL6 to formthe via portion V5.

The configuration of the pad PD, the insulating film PA (including theopening OP), and the laminated film LM1 is the same as described abovewith reference to FIG. 6. Therefore, a repeated description thereof isomitted herein.

FIG. 9 is a cross-sectional view showing a state where the wire (bondingwire) WA is electrically coupled to the pad PD shown in FIG. 6 describedabove and shows a cross-sectional view of the region corresponding toFIG. 6 described above. In the semiconductor devices PKG1 and PKG2 inFIGS. 2 and 3 described above, as shown in FIG. 9, the wire WA iselectrically coupled to the pad PD. By contrast, in FIG. 9, theillustration of a sealing resin (corresponding to the foregoing sealingportion MR1 or MR2) is omitted.

As shown in FIG. 9, to the pad PD, the wire WA is electrically coupledas a coupling member. The wire WA is a copper (Cu) wire containingcopper (Cu) as a main component. As the wire WA, not only a copper (Cu)wire entirely made of copper (Cu), but also a copper (Cu) wire having atop surface thereof covered with a palladium (Pd) film or the like canbe used.

In the present embodiment, over the pad PD exposed from the opening OPof the insulating film PA, the laminated film LM1 including the barrierconductor film BR3, and the metal film ME1 is formed. Accordingly, whenwire bonding is performed on the pad PD, the wire WA is coupled (bonded)to the laminated film LM1 over the pad PD. That is, the wire WA iscoupled (bonded) to the portion of the laminated film LM1 which islocated over the pad PD exposed from the opening OP of the insulatingfilm PA. In short, the wire WA is not directly coupled to theAl-containing conductive film AM1 included in the pad PD. Instead, thewire WA is pressed against and coupled (bonded) to the laminated filmLM1 over the Al-containing conductive film AM1 (more specifically,against the metal film ME1) in the state where the laminated film LM1including the barrier conductor film BR3, and the metal film ME1 isformed over the Al-containing conductive film AM1 included in the padPD. As a result, when wire bonding is performed to electrically couplethe wire WA to the pad PD, between the Al-containing conductive film AM1included in the pad PD and the wire WA, the laminated film including thebarrier conductor film BR3, and the metal film ME1 over the barrierconductor film BR3 is interposed. The barrier conductor film BR3 islocated closer to the Al-containing conductive film AM1, while the metalfilm ME1 is located closer to the wire WA.

The wire WA is a copper wire and made of a hard material. Accordingly,by compressing the wire WA to the laminated structure (morespecifically, the metal film ME1 in the uppermost layer of the laminatedstructure) including the pad PD, and the laminated film LM1 with theapplication of a mechanical pressure, a high bonding strength can beobtained. In addition, the copper (Cu) wire which is less costly than agold (Au) wire has the advantage of allowing a cost reduction.

<About Manufacturing Process of Semiconductor Device>

Referring to FIGS. 10 to 20, a description will be given of themanufacturing process of the semiconductor device CP in the presentembodiment. FIG. 10 is a process flow chart showing a part of themanufacturing process of the semiconductor device CP in the presentembodiment. FIGS. 11 to 20 are main-portion cross-sectional views of thesemiconductor device CP in the present embodiment during themanufacturing process thereof.

The fourth wiring layer (wiring layer including the wires ME4) and thestructure located below the fourth wiring layer, which are shown in FIG.7 described above, can be formed using a known semiconductormanufacturing technique.

That is, as shown in FIG. 11, the isolation regions ST are formed in thesemiconductor substrate SB using a STI method. Then, using an ionimplantation method, the p-type well PW and the n-type well NW areformed. Over the p-type well PW and the n-type well NW, the gateelectrodes GE1 and GE2 are formed via the gate insulating films GF.Then, using an ion implantation method, the n-type semiconductor regionsNS and the p-type semiconductor regions PS are formed. Thus, in thesemiconductor substrate SB, the n-channel MISFET Qn and the p-channelMISFET Qp are formed.

Then, over the semiconductor substrate SB, the interlayer insulatingfilm IL1 is formed so as to cover the MISFETs Qn and Qp. Then, in theinterlayer insulating film IL1, contact holes are formed using aphotolithographic technique and a dry etching technique. Then, in thecontact holes, a conductive film is embedded to form the plugs V1.

Subsequently, over the interlayer insulating film IL1 in which the plugsV1 are embedded, the interlayer insulating film IL2 is formed. Then, inthe interlayer insulating film IL2, using a single damascene technique,the wires M1 are embedded. Then, over the interlayer insulating film IL2in which the wires M1 are embedded, the interlayer insulating film IL3is formed. Then, in the interlayer insulating film IL3, using a dualdamascene technique, the wires M2 and the via portions V2 are embedded.Then, over the interlayer insulating film IL3 in which the wires M2 areembedded, the interlayer insulating film IL4 is formed. Then, in theinterlayer insulating film IL4, using a dual damascene technique, thewires M3 and the via portions V3 are embedded. Then, over the interlayerinsulating film IL4 in which the wires M3 are embedded, the interlayerinsulating film IL5 is formed. Then, in the interlayer insulating filmIL5, using a dual damascene technique, the wires M4 and the via portionsV4 are embedded.

After the interlayer insulating film IL5, the wires M4, and the viaportions V4 which are embedded in the interlayer insulating film IL5 areformed using the dual damascene technique, over the interlayerinsulating film IL5 in which the wires M4 are embedded, the interlayerinsulating film IL6 is formed.

Next, using a photolithographic technique and an etching technique, theopening SH is formed in the interlayer insulating film IL6. When theopening SH is formed in the interlayer insulating film IL6, the uppersurface of the wire M4 is exposed at the bottom portion of the openingSH.

Next, over the interlayer insulating film IL6, a conductive film for thevia portion V5 is formed so as to be embedded in the opening SH. Then,using a CMP (Chemical Mechanical Polishing) method, an etch-back method,or the like, the conductive film (conductive film for the via portionV5) located outside the opening SH is removed, while the conductive film(conductive film for the via portion V5) is left in the opening SH.Thus, the via portion V5 made of the conductive film (conductive filmfor the via portion V5) embedded in the opening SH can be formed.

FIG. 11 shows the laminated structure from the semiconductor substrateSB to the fourth wiring layer (the wires M4 and the interlayerinsulating film IL5). However, for simpler illustration, in FIGS. 12 to20 subsequent thereto, the illustration of the structure located belowthe interlayer insulating film IL6 is omitted. While FIG. 11 shows across-sectional region corresponding to FIG. 7 described above, each ofFIGS. 12 to 20 shows the cross-sectional region corresponding to FIG. 6described above. Accordingly, in FIGS. 12 to 20, the illustration of theopening SH and the via portion V5 is omitted.

Next, over the interlayer insulating film IL6 in which the via portionV5 is embedded, as shown in FIG. 12, the barrier conductor film BR1, theAl-containing conductive film AM1, and the barrier conductor film BR2are successively formed to form the laminated film SM including thebarrier conductor film BR1, the Al-containing conductive film AM1 overthe barrier conductor film BR1, and the barrier conductor film BR2 overthe Al-containing conductive film AM1 (Step S21 in FIG. 12). Each of thebarrier conductor film BR1, the Al-containing conductive film AM1, andthe barrier conductor film BR2 can be formed using a sputtering methodor the like. The step of forming the Al-containing conductive film AM1can be formed continuously after the step of forming the barrierconductor film BR1. The step of forming the barrier conductor film BR2can be performed continuously after the step of forming theAl-containing conductive film AM1.

Next, using a photolithographic technique and an etching technique, thelaminated film SM is patterned to form the pad PD (Step S22 in FIG. 12).At this stage, the entire pad PD is made of the laminated film includingthe barrier conductor film BR1, the Al-containing conductive film AM1over the barrier conductor film BR1, and the barrier conductor film BR2over the Al-containing conductive film AM1.

Specifically, the patterning step in S22 can be performed as follows.First, as shown in FIG. 13, over the laminated film SM, the photoresistpattern RP1 is formed using a photolithographic technique. Then, usingthe photoresist pattern RP1 as an etching mask, the laminated film SM isetched. The step of etching the laminated film SM includes the step ofetching the barrier conductor film BR2, the step of etching theAl-containing conductive film AM1, and the step of etching the barrierconductor film BR1. By the etching, the laminated film SM is patternedto form the pad PD made of the patterned laminated film SM. Thereafter,the photoresist pattern RP1 is removed. FIG. 14 shows the resultingstage. Thus, the patterning step in Step S22 is performed. Note that,when the laminated film SM is patterned in Step S22, not only the padPD, but also the wires in the same layer as that of the pad PD can alsobe formed.

Heretofore, the case where the via portion V5 and the pad PD areseparately formed has been illustrated and described. However, inanother form, the via portion V5 can also be formed integrally with thepad PD. In that case, in the state where the via portion V5 is notformed, the laminated film SM is formed over the interlayer insulatingfilm IL6 including the inside of the opening SH and then patterned usinga photolithographic technique and an etching technique to form the padPD. Thus, of the patterned laminated film SM, the pad PD and the viaportion V5 are integrally formed.

Next, as shown in FIG. 15, over the interlayer insulating film IL6, theinsulating film PA is formed so as to cover the pad PD (Step S23 in FIG.10). As the insulating film PA, a single-layer insulating film or alaminated insulating film in which a plurality of insulating films arestacked can be formed. For example, a silicon dioxide film, a siliconnitride film, or a laminated film thereof (laminated film including,e.g., a silicon dioxide film, and a silicon nitride film over thesilicon dioxide film) can be used as the insulating film PA. Theinsulating film forming the insulating film PA can be formed using aplasma CVD (Chemical Vapor Deposition) method or the like. As theinsulating film PA, a resin film (organic insulating film) such as apolyimide resin can also be used.

Next, in the insulating film PA, the opening OP is formed (Step S24 inFIG. 10). In Step S24, the opening OP can be formed, e.g., as follows.That is, as shown in FIG. 16, over the insulating film PA, a photoresistpattern RP2 is formed using a photolithographic technique. Then, usingthe photoresist pattern RP2 as an etching mask, the insulating film PAis etched such that the opening OP is formed therein. Thereafter, thephotoresist pattern RP2 is removed. FIG. 17 shows the resulting stage.

In the etching step for forming the opening OP in the insulating filmPA, the insulating film PA is etched such that the opening OP is formedtherein to expose the barrier conductor film BR2 of the pad PD. Then,the barrier conductor film BR2 exposed from the opening OP is furtherremoved by the etching to expose the Al-containing conductive film AM1of the pad PD from the opening OP. That is, in the region overlappingthe opening OP in plan view, not only the insulating film PA, but alsothe barrier conductor film BR2 forming the pad PD is etched and removed.Consequently, the upper surface of the Al-containing conductive film AM1included in the pad PD is exposed. On the other hand, in the regioncovered with the insulating film PA even after the opening OP is formed,the barrier conductor film BR2 is not removed and remains.

Next, as shown in FIG. 18, over the insulating film PA including theside wall of the opening OP, and the upper surface of the pad PD exposedfrom the opening OP (which is the Al-containing conductor film AM1herein), the barrier conductor film BR3 and the metal film ME1 aresuccessively formed to form a laminated film LM1 a including the barrierconductor film BR3, and the metal film ME1 over the barrier conductorfilm BR3 (Step S25 in FIG. 10). Each of the barrier conductor film BR3and the metal film ME1 is preferably formed using a sputtering method.At this stage, the laminated film LM1 a including the barrier conductorfilm BR3, and the metal film ME1 over the barrier conductor film BR3 isformed over the entire upper surface of the insulating film PA includingthe side wall of the opening OP, and the upper surface of the pad PDexposed from the opening OP.

After the opening OP is formed and immediately before the barrierconductor film BR is formed by the sputtering method, the top surface ofthe underlay (especially the top surface of the pad PD exposed from theopening OP) can also be subjected to cleaning treatment (preferably,plasma cleaning treatment). This allows the barrier conductor film BR3to be formed over the clean top surface of the pad PD and thus allows afurther improvement in the adhesion of the barrier conductor film BR3 tothe upper surface of the pad PD. The cleaning treatment is preferablyperformed by plasma treatment. For example, oxygen or argon plasmatreatment can be used appropriately. Note that, in the case in thesecond embodiment described later, the cleaning treatment (plasmacleaning treatment) is performed after the opening OP is formed andimmediately before the metal film ME1 is formed by a sputtering method.

Next, using a photolithographic technique and an etching technique, thelaminated film LM1 a is patterned to form the laminated film LM1 (StepS26 in FIG. 10).

Specifically, the patterning step in Step S26 can be performed asfollows. First, as shown in FIG. 19, over the laminated film LM1 a, aphotoresist pattern RP3 is formed using a photolithographic technique.Then, using the photoresist pattern RP3 as an etching mask, thelaminated film LM1 a is etched. Thus, the portion of the laminated filmLM1 a which is uncovered with and exposed from the photoresist patternRP3 is etched and removed, while the portion of the laminated film LM1 awhich is covered with the photoresist pattern RP3 is not etched andremains. The step of etching the laminated film LM1 a includes the stepof etching the metal film ME1, and the step of subsequently etching thebarrier conductor film BR3. The step of etching the metal film ME1 andthe step of etching the barrier conductor film BR3 can be performedunder varied etching conditions (such as, e.g., the type and flow rateof an etching gas). Thereafter, the photoresist pattern RP3 is removed.FIG. 20 shows the resulting stage. Thus, the patterning step in Step S26is performed. The laminated film LM1 a patterned in Step S26 serves asthe laminated film LM1.

After the photoresist pattern RP3 is formed and before the etching step(which is the step of etching the metal film ME1 herein) using thephotoresist pattern RP3 is performed, oxygen or argon plasma treatmentcan also be performed. This allows, even when an impurity has beendeposited over the photoresist pattern RP3, the top surface of thephotoresist pattern RP3 to be ground together with the impurity. Thus,the top surface of the photoresist pattern RP3 can be cleaned. As aresult, it is easier to prevent an impurity from being deposited overthe top surface of the metal film ME1 due to the photoresist patternRP3. The same applies to each of modifications and the second and thirdembodiments described later.

After the photoresist pattern RP3 is removed, oxygen plasma treatmentcan also be performed. By performing the oxygen plasma treatment, evenwhen the top surface of the underlying insulating film PA has beendamaged by the formation of the barrier conductor film BR3 by asputtering method, the damaged layer can be restored. Note that, in thecase in a third modification described later, the oxygen plasmatreatment is performed after the structure in FIG. 38 described later isobtained. In the case in the second embodiment described later, theoxygen plasma treatment is performed after the structure in FIG. 37described later or the structure in FIG. 52 described later is obtained.

Subsequently, the back surface side of the semiconductor substrate SB isground or polished as necessary to reduce the thickness of thesemiconductor substrate SB. Then, the semiconductor substrate SB issubjected to dicing (cutting) together with the laminated structure overthe semiconductor substrate SB. At this time, the semiconductorsubstrate SB and the laminated structure over the semiconductorsubstrate SB are diced (cut) along scribe regions.

In this manner, the semiconductor device (semiconductor chip) CP can bemanufactured.

About First Studied Example

FIG. 21 is a main-portion cross-sectional view of a semiconductor deviceCP101 in the first studied example studied by the present inventors,which corresponds to FIG. 6 described above in the present embodiment.

In the semiconductor device (semiconductor chip) CP101 in the firststudied example shown in FIG. 21, no equivalent to the foregoinglaminated film LM1 is formed. That is, in the semiconductor device CP101in the first studied example shown in FIG. 21, a pad PD101 correspondingto the pad PD is formed of a laminated film including a barrierconductor film BR101, an aluminum film AM101 over the barrier conductorfilm BR101, and a barrier conductor film BR102 over the aluminum filmAM101. The barrier conductor film BR101 corresponds to the foregoingbarrier conductor film BR1. The barrier conductor film BR102 correspondsto the foregoing barrier conductor film BR2. The aluminum film AM101corresponds to the foregoing Al-containing conductive film AM1. Theportion of the barrier conductor film BR102 which is exposed from theopening OP of the insulating film PA has been removed. Consequently, atthe bottom portion of the opening OP, the upper surface of the aluminumfilm AM101 included in the pad PD101 is exposed. Over the pad PD101, noequivalent to the foregoing laminated film LM1 is formed.

FIG. 22 is a cross-sectional view showing the state where, in thesemiconductor device P101 in the first studied example shown in FIG. 21,a copper wire WA101 is electrically coupled to the pad PD101, whichcorresponds to FIG. 9 described above.

As shown in FIG. 22, to the pad PD101 exposed from the opening OP of theinsulating film PA, the copper wire WA101 corresponding to the foregoingwire WA is coupled.

In the first studied example shown in FIG. 21, over the pad PD101exposed from the opening OP of the insulating film PA, no equivalent tothe foregoing laminated film LM1 has been formed. From the opening OP ofthe insulating film PA, the upper surface of the aluminum film AM101included in the pad PD101 is exposed. As a result, when wire bonding isperformed to the pad PD101, as shown in FIG. 22, the copper wire WA101is coupled (bonded) directly to the aluminum film AM101 included in thepad PD101.

As a result of study, the present inventors have found that, in the casein the first studied example shown in FIGS. 21 and 22, such a problem asdescribed below arises.

FIGS. 23A to 23C are cross-sectional views each showing the vicinity ofthe region where the copper wire WA101 is coupled to the pad PD101 inthe semiconductor device CP101 in the first studied example shown inFIG. 22.

Each of FIG. 23A and FIGS. 24A and 27A described later corresponds tothe state immediately after a semiconductor package was manufactured.Each of FIG. 23B and FIGS. 24B and 27B described later corresponds tothe state after a high-temperature storage test (at 240° C.) wasperformed on the semiconductor package. Each of FIG. 23C and FIGS. 24Cand 27C described later corresponds to the state immediately after ahigh-temperature/humidity test (at 130° C./85% RH) was performed on thesemiconductor package. The semiconductor package corresponds to theforegoing semiconductor device PKG1 or PKG2. Note that each of FIGS. 23Ato 23C and FIGS. 24A to 24C and 27A to 27C described later is drawn onthe basis of a TEM (Transmission Electron Micrograph).

At the stage immediately after the semiconductor package wasmanufactured using the semiconductor device CP101 in the first studiedexample, as also shown in FIG. 23A, at the junction interface betweenthe aluminum film AM101 included in the pad PD101 and the copper wireWA101, a reaction product (compound) between Al (aluminum) forming thealuminum film AM101 and Cu (copper) forming the copper wire WA101 isformed in a small quantity. The reaction product is Cu₉Al₄ or CuAl.

In each of FIGS. 23A and 23C, the state (quantity and composition) ofthe reaction product (compound) between Al and Cu at the junctioninterface between the aluminum film AM101 and the copper wire WA101 issubstantially the same. This indicates that, even when thehigh-temperature/humidity test (at 130° C./85% RH) is performed on thesemiconductor package manufactured using the semiconductor device CP101in the first studied example, the reaction product (compound) between Alforming the aluminum film AM101 and Cu forming the copper wire WA101does not considerably increase in the vicinity of the junction interfacebetween the aluminum film AM101 included in the pad PD101 and the copperwire WA101.

However, the state (quantity and composition) of the reaction product(compound) between Al and Cu in the vicinity of the junction interfacebetween the aluminum film AM101 and the copper wire WA101 in FIG. 23A issignificantly different from that in FIG. 23B. After thehigh-temperature storage test (at 240° C.) was performed, as also shownin FIG. 23B, in the vicinity of the junction interface between thealuminum film AM101 included in the pad PD101 and the copper wire WA101,the reaction product (compound) between Al forming the aluminum filmAM101 and Cu forming the copper wire WA101 was produced in a largequantity. The reaction product (compound) is Cu₉Al₄, Cu₃Al₂, or CuAl.That is, when the high-temperature storage test (at 240° C.) isperformed on the semiconductor package manufactured using thesemiconductor device CP101 in the first studied example, the state shownin FIG. 23A shifts to the state shown in FIG. 23B and the reactionproduct (compound) between Al forming the aluminum film AM101 and Cuforming the copper wire WA101 significantly increases.

A compound between Al and Cu, especially Cu₉Al₄, has low corrosionresistance (i.e., is susceptible to corrosion). In addition, Cu₉Al₄ isalso susceptible to NaCl (sodium chloride) or the like and thereforesusceptible to Cl (chlorine) ions or the like. Accordingly, even in aneutral environment, Cu₉Al₄ may be corroded.

As a result, when a compound between Al and Cu (especially Cu₉Al₄) isformed in a large quantity in the vicinity of the junction interfacebetween the aluminum film AM101 included in the pad PD101 and the copperwire WA101, the reliability of the coupling of the copper wire WA101 tothe pad PD101 may deteriorate to possibly degrade the reliability of thesemiconductor package. Specifically, when a compound between Al and Cu(especially Cu₉Al₄) is formed in a large quantity in the vicinity of thejunction interface between the aluminum film AM101 included in the padPD101 and the copper wire WA101, e.g., the strength of the coupling ofthe copper wire WA101 to the pad PD101 decreases or the couplingresistance between the pad PD101 and the copper wire WA101 increases. Inthe worst case, the electric coupling between the copper wire WA101 andthe pad PD101 is removed to cause a disconnection failure.

A compound between Al and Cu (especially Cu₉Al₄) is formed in a largequantity in the vicinity of the junction interface between the aluminumfilm AM101 included in the pad PD101 and the copper wire WA101 in thecase where the high-temperature storage test (at 240° C.) is performed,not in the case where the high-temperature/humidity test (at 130° C./85%RH) is performed. This indicates that the reaction between Al formingthe aluminum film AM101 and Cu forming the copper wire WA101 isaccelerated by a temperature factor. Note that a test object (which isthe semiconductor package herein) is exposed to a higher ambienttemperature in the high-temperature storage test (at 240° C.) than inthe high-temperature/humidity test (at 130° C./85% RH). When the testobject is exposed to such a high-temperature environment for a longperiod of time, in the vicinity of the junction interface between thealuminum film AM101 included in the pad PD101 and the copper wire WA101,corrosion by S (sulfur) or a sulfide occurs between a Cu region (copperwire) and a Cu₉Al₄ region to degrade the reliability of the coupling ofthe copper wire WA101 to the pad PD101. On the other hand, in ahigh-temperature/humidity environment, a compound between Al and Cu(especially Cu₉Al₄) is corroded by Cl (chlorine), a chloride, Br(bromine), or a bromide to be changed to alumina. This degrades thereliability of the coupling of the copper wire WA101 to the pad PD101

The problem described heretofore with reference to the first studiedexample occurs when a copper wire is coupled to an aluminum pad, butdoes not occur when a gold wire is coupled to an aluminum pad. That is,the present inventors could find the problem as a result of examiningthe use of a copper wire and actively performing the analysis of thereaction product between an aluminum pad and a copper wire inconjunction with a reliability test.

<About Main Characteristic Features and Effects>

The semiconductor device CP in the present embodiment includes thesemiconductor substrate SB, the interlayer insulating film IL6 (firstinsulating film) formed over the semiconductor substrate SB, the pad PDformed over the interlayer insulating film IL6, the insulating film PA(second insulating film) formed over the interlayer insulating film IL6so as to cover the pad PD, and the opening OP formed in the insulatingfilm PA to expose a part of the pad PD. The pad PD is a pad to which acopper wire (wire WA) is to be coupled and includes the Al-containingconductive film AM1 containing aluminum as a main component. Over theAl-containing conductive film AM1 in the region overlapping the openingOP in plan view, the laminated film including the barrier conductor filmBR3 (first conductor film), and the metal film ME1 (second conductorfilm) over the barrier conductor film BR3 is formed. In the laminatedfilm, the metal film ME1 is in the uppermost layer.

The semiconductor device PKG (PKG1 or PKG2) in the present embodimentincludes the semiconductor device (semiconductor chip) CP having the padPD, the wire WA (copper wire) electrically coupled to the pad PD of thesemiconductor device CP, and the sealing resin portion (MR1 or MR2)sealing therein the semiconductor device CP and the wire WA. The pad PDincludes the Al-containing conductive film AM1 containing aluminum as amain component. Between the wire WA and the Al-containing conductivefilm AM1, the laminated film including the barrier conductor film BR3(first conductor film), and the metal film ME1 (second conductor film)over the barrier conductor film BR3 is interposed. The wire WA is bondedto the metal film ME1.

The barrier conductor film BR3 (first conductor film) is a single-layerfilm or a laminated film including at least one or more layers of filmsselected from the group consisting of a titanium (Ti) film, a titaniumnitride (TiN) film, a tantalum (Ta) film, a tantalum nitride (TaN) film,a tungsten (W) film, a tungsten nitride (WN) film, a titanium-tungsten(TiW) film, and a tantalum-tungsten (TaW) film. The metal film ME1(second conductor film) is made of one or more metals selected from thegroup consisting of palladium (Pd), gold (Au), ruthenium (Ru), rhodium(Rh), platinum (Pt), and iridium (Ir).

One of the main characteristic features of the present embodiment isthat the pad PD of the semiconductor device CP is a pad to which thecopper wire (wire WA) is to be coupled. Accordingly, in thesemiconductor device PKG using the semiconductor device (semiconductorchip) CP, the copper wire (corresponding to the wire WA) is electricallycoupled to the pad PD of the semiconductor device CP.

Another one of the main characteristic features of the presentembodiment is that, in the semiconductor device CP, the pad PD includesthe Al-containing conductive film AM1 containing aluminum as a maincomponent and, over the Al-containing conductive film AM1 in a regionoverlapping the opening OP of the insulating film PA in plan view, thebarrier conductor film BR3 and the metal film ME1 over the barrierconductor film BR3 are formed. Accordingly, in the semiconductor devicePKG using the semiconductor device (semiconductor chip) CP, between thewire WA (copper wire) and the Al-containing conductive film AM1, thelaminated film including the barrier conductor film BR3, and the metallayer ME1 over the barrier conductor film BR3 is interposed so that thewire WA is bonded to the metal film ME1. The barrier conductor film BR3is a single-layer film or a laminated film including at least one ormore layers of films selected from the group consisting of a titaniumfilm, a titanium nitride film, a tantalum film, a tantalum nitride film,a tungsten film, a tungsten nitride film, a titanium-tungsten film, anda tantalum-tungsten film. The metal film ME1 is made of one or moremetals selected from the group consisting of palladium (Pd), gold (Au),ruthenium (Ru), rhodium (Rh), platinum (Pt), and iridium (Ir).

That is, in the present embodiment, the copper wire (wire WA) iselectrically coupled to the pad PD as the aluminum pad. Between theAl-containing conductive film AM1 forming the pad PD and the copper wire(wire WA), the laminated film including the barrier conductor film BR3,and the metal film ME1 over the barrier conductor film BR3 isinterposed, and the respective materials of the barrier conductor filmBR3 and the metal film ME1 are chosen as described above. This canimprove the reliability of the coupling of the copper wire (wire WA) tothe pad PD and consequently improve the reliability of each of thesemiconductor device CP and the semiconductor device PKG using thesemiconductor device CP. The reason for this will be described below.

FIG. 24 is a cross-sectional view showing the vicinity of the regionwhere the copper wire (wire WA) is coupled to the pad PD in thesemiconductor device CP in the present embodiment in FIG. 9 describedabove, which corresponds to FIG. 23 described above. Note that FIG. 24shows the case where the barrier conductor film BR3 is a titanium (Ti)film, and the metal film ME1 is a palladium (Pd) film.

In the present embodiment, the wire WA (copper wire) is electricallycoupled to the pad PD in the semiconductor device CP. Over the portion(i.e., portion exposed from the opening OP) of the Al-containingconductive film AM1 which overlaps the opening OP in plan view, thebarrier conductor film BR3 and the metal film ME1 over the barrierconductor film BR3 are formed. The outermost surface in the region towhich the wire WA is coupled is the metal film ME1 (Pd) film. That is,in wire bonding, the wire WA comes into contact with the metal film ME1(Pd film) in the outermost surface. Accordingly, the wire WA is coupled(bonded) to the metal film ME1.

Therefore, at the stage immediately after the semiconductor package ismanufactured using the semiconductor device CP in the presentembodiment, as also shown in FIG. 24A, in the vicinity of the junctioninterface between the metal film ME1 and the wire WA, a reaction product(compound) between the metal element (which is Pd herein) forming themetal film ME1 and Cu (copper) forming the wire WA may be formed in asmall quantity. The reaction product (compound) is a CuPd (CuPd) (CuPdsolid solution or Cu₁Pd₁ intermetallic compound).

In each of FIGS. 24A and 24C, the state (quantity and composition) ofthe reaction product (compound) between Pd and Cu in the vicinity of thejunction interface between the metal film ME1 and the wire WA issubstantially the same. This indicates, even when thehigh-temperature/humidity test (at 130° C./85% RH) is performed on thesemiconductor package manufactured using the semiconductor device CP, inthe vicinity of the junction interface between the metal film ME1 andthe wire WA, the reaction product (compound) between the metal element(which is Pd herein) forming the metal film ME1 and Cu (copper) formingthe wire WA scarcely increases.

When the temperature set in the high-temperature storage test was nothigher than 200° C., even though the high-temperature storage test wasperformed, in the vicinity of the junction interface between the metalfilm ME1 and the copper wire (wire WA), the reaction product (compound)between the metal element (which is Pd herein) forming the metal filmME1 and Cu forming the copper wire (wire WA) scarcely increased(substantially the same state as in FIG. 24A was observed).

On the other hand, after the high-temperature storage test at 240° C.was performed, as also shown in FIG. 24B, in the vicinity of thejunction interface between the metal film ME1 and the copper wire (wireWA), the quantity of the reaction product (compound) produced betweenthe metal element (which is Pd herein) forming the metal film ME1 and Cu(copper) forming the wire WA slightly increased. However, the incrementwas not so large. No change was observed in the phase (composition) ofthe produced reaction product and only the quantity of CuPd (CuPd solidsolution or Cu₁Pd₁ intermetallic compound) increased. Since CuPd (CuPdsolid solution or Cu₁Pd₁ intermetallic compound) is immune to corrosionand has high corrosion resistance, even when CuPd is generated in thevicinity of the junction interface between the metal film ME1 and thecopper wire (wire WA), the reliability of the coupling of the wire WAscarcely deteriorates.

The reaction product (compound) between the metal element forming themetal film ME1 and Cu forming the wire WA has corrosion resistance(resistance to corrosion) higher than that of a reaction product(compound) between Al and Cu, especially Cu₉Al₄. That is, the metalelement forming the metal film ME1 is chosen such that, even when placedin a high-temperature environment such as in a high-temperature storagetest, the metal element forming the metal film ME1 and Cu forming thewire WA do not react with each other and produce a reaction product(compound) having low corrosion resistance. Specifically, the metalelement forming the metal film ME1 is one or more selected from thegroup consisting of Pd, Au, Ru, Rh, Pt, and Ir. More preferably, themetal element forming the metal film ME1 is Pd.

The barrier conductor film BR3 is formed of a material as mentionedabove and has a high melting point and low reactivity to the metalelement (which is Pd herein) forming the metal film ME1 and Al(aluminum) forming the Al-containing conductive film AM1. Accordingly,not only at the stage immediately after the semiconductor package ismanufactured using the semiconductor device CP in the presentembodiment, but also at the stage where the high-temperature/humiditytest (at 130° C./85% RH) is performed and at the stage where thehigh-temperature storage test (at 240° C.) is performed also, thebarrier conductor film BR3 scarcely reacts with the metal element (whichis Pd herein) forming the metal film ME1 and Al forming theAl-containing conductive film AM1.

The barrier conductor film BR3 can also function to prevent Al(aluminum) forming the Al-containing conductive film AM1 from beingdiffused into the metal film ME1. Additionally, the barrier conductorfilm BR3 can also function to prevent Cu (copper) forming the wire WAfrom being diffused into the Al-containing conductive film AM1. This canprevent a reaction between Al (aluminum) forming the Al-containingconductive film AM1 and Cu (copper) forming the wire WA. Thus, it ispossible to prevent Al forming the Al-containing conductive film AM1 andCu forming the wire WA from reacting with each other and consequentlyproducing a reaction product (compound) having low corrosion resistance,particularly producing Cu₉Al₄. This allows an improvement in thereliability of the coupling of the wire WA.

Unlike in the present embodiment, the case where no equivalent to thebarrier conductor film BR3 can also be considered. This case will bedescribed as a second studied example.

FIG. 25 is a main-portion cross-sectional view of a semiconductor deviceCP201 in the second studied example studied by the present inventors,which corresponds to FIG. 21 described above in the first studiedexample. FIG. 26 is a cross-sectional view showing the state where, inthe semiconductor device CP201 in the second studied example shown inFIG. 25, the copper wire WA101 is electrically coupled to the pad PD101,which corresponds to FIG. 22 described above in the foregoing firststudied example.

In the second studied example shown in FIGS. 25 and 26, no equivalent tothe barrier conductor film BR3 is formed. Over the portion of thealuminum film AM101 which is exposed from the opening OP, a palladium(Pd) film ME101 is formed and, to the palladium film ME101, the copperwire WA101 is coupled. That is, in the first studied example shown inFIG. 22 described above, to the aluminum film AM101 included in the padPD101, the copper wire WA101 is directly coupled. By contrast, in thesecond studied example in FIG. 26, to the palladium film ME101 over thealuminum film AM101 included in the pad PD101, the copper wire WA101 iscoupled.

FIG. 27 is a cross-sectional view showing, in enlarged relation, thevicinity of the region where the copper wire WA101 is coupled to the padPD101 in the semiconductor device CP201 in the second studied exampleshown in FIG. 26. FIG. 27 corresponds to FIGS. 23 and 24 describedabove.

In the case in the second studied example shown in FIGS. 25 and 26, thecopper wire WA101 is coupled to the palladium (Pd) film. Between thepalladium (Pd) film and the aluminum film AM101, no equivalent to thebarrier conductor film BR3 is formed. At the stage immediately after thesemiconductor package is manufactured, as also shown in FIG. 27A, in thevicinity of the junction interface between the palladium film ME101 andthe copper wire WA101, a reaction product (CuPd) between Pd (palladium)forming the palladium film ME101 and Cu (copper) forming the wire WA isformed in a small quantity. The quantity and composition of the reactionproduct is substantially the same as in the case in FIG. 24A describedabove. That is, in each of FIGS. 24A and 27A, the state (quantity andcomposition) of the reaction product (compound) between Pd and Cu in thevicinity of the junction interface between the palladium film (ME1 orME101) and the copper wire (WA or WA101) is substantially the same. Ineach of FIGS. 24C and 27C also, the state (quantity and composition) ofthe reaction product (compound) between Pd and Cu in the vicinity of thejunction interface between the palladium film (ME1 or ME101) and thecopper wire (WA or WA101) is substantially the same.

However, the state (quantity and composition) of a reaction product(compound) derived from Cu (copper) forming the copper wire (WA orWA101) in FIG. 27B is significantly different from that in FIG. 24B.

That is, in the case in the second studied example in which noequivalent to the barrier conductor film BR3 is provided unlike in thepresent embodiment, after a high-temperature storage test (at 240° C.)is performed, a reaction layer is formed in a large quantity between thealuminum film AM101 and the copper wire WS101, as also shown in FIG.27B. The reaction layer is a compound layer formed of Cu (copper), Pd(palladium), and Al (aluminum), i.e., a Cu—Pd—Al layer (Cu—Pd—Alcompound layer). That is, between the aluminum film AM101 and the copperwire WA101, the Cu—Pd—Al layer as a reaction layer between Al(aluminum), Pd (palladium), and Cu (copper) is generated in a largequantity. A conceivable reason why the reaction layer between Al, Pd,and Cu, not a reaction layer between Pd and Cu, is generated is that Alforming the aluminum film AM101 is diffused into the palladium filmME101 and diffused Al reacts with Cu forming the copper wire WA101 inconjunction with Pd. That is, unlike in the present embodiment, in thecase in the second studied example where no equivalent to the barrierconductor film BR3 is provided, in a high-temperature environment suchas in a high-temperature storage test, the diffusion of Al from thealuminum film AM101 into the palladium film ME101 cannot be prevented.Consequently, the diffused Al undesirably reacts with Cu forming thecopper wire WA101.

The reaction product (compound) between Al, Cu, and Pd containing Pd isaccordingly more resistant to corrosion than Cu₉Al₄, but the corrosionresistance thereof is still low. In a high-temperature environment,corrosion by S (sulfur) or a sulfide proceeds between a Cu region(copper wire) and a Cu—Pd—Al compound layer.

That is, in the case in the second studied example in which noequivalent to the barrier conductor film BR3 is provided unlike in thepresent embodiment, when a high-temperature storage test (at 240° C.) isperformed, as shown in FIG. 27B, a reaction layer (compound layer)containing Al and Cu is undesirably generated between the aluminum filmAM101 included in the pad PD101 and the copper wire WA101. Since thereaction layer shows low corrosion resistance to S (sulfur) or asulfide, the reliability of the coupling of the copper wire WA101deteriorates to degrade the reliability of the semiconductor package.

By contrast, in the present embodiment, between the Al-containingconductive film AM1 included in the pad PD and the copper wire (wireWA), not only the metal film ME1, but also the barrier conductor filmBR3 is interposed. The barrier conductor film BR3 is present immediatelyunder the metal film ME1 and consequently interposed between theAl-containing conductive film AM1 included in the pad PD and the metalfilm ME1. During the high-temperature storage test (at 240° C.), thebarrier conductor film BR3 can function to prevent Al forming theAl-containing conductive film AM1 from reacting with Cu forming the wireWA.

Another case is assumed where, unlike in the present embodiment, themetal film ME1 is not provided and the wire WA is directly coupled tothe barrier conductor film BR3 formed over the Al-containing conductivefilm AM1. In this case, it may be impossible to ensure the bondingstrength between the barrier conductor film BR3 and the wire WA. This isbecause a material which allows the wire WA to be easily coupled theretoand allows the bonding strength of the wire WA to be easily ensured isnot appropriate as the material of a film which prevents the diffusionof Al. For example, the case is assumed where a copper wire is coupledto a titanium film. When an oxide film has been formed over the topsurface of the titanium film due to the susceptibility of the titaniumfilm to oxidation, it is difficult to couple the copper wire to thetitanium film, resulting in a reduction in bonding strength. Inaddition, since the titanium film is hard, it is difficult to couple thecopper wire thereto and ensure the bonding strength. Moreover, since thetitanium film is unreactive to the copper wire, it is also difficult toensure the bonding strength in this respect.

By contrast, in the present embodiment, in wire bonding, the wire WAcomes into contact with the metal film ME1 and is coupled (bonded) tothe metal film ME1. For the metal film ME1, a material which allows thewire WA to be easily coupled thereto and allows the bonding strength ofthe wire WA to be easily ensured is used. As a result, the wire WA iseasily coupled and the bonding strength of the wire WA is easilyensured.

That is, in the present embodiment, the wire WA is not coupled directlyto the Al-containing conductive film AM1 containing Al as a maincomponent. Instead, over the Al-containing conductive film AM1, thelaminated film which includes the barrier conductor film BR3, and themetal film ME1 over the barrier conductor film BR3 and in which themetal film ME1 is in the uppermost layer is formed, and the wire WA iscoupled to the metal film ME1. As the metal film ME1, a material filmwhich allows the wire WA to be easily coupled thereto and allows thebonding strength of the wire WA to be easily ensured is used. Even whenplaced in a high-temperature environment such as in a high-temperaturestorage test, the material film is prevented from reacting with Cuforming the wire WA and producing a reaction product having lowcorrosion resistance (i.e., susceptible to corrosion). As the barrierconductor film BR3, a material film which can prevent Al forming theAl-containing conductive film AM1 from being diffused into the metalfilm ME1 and reacting with Cu forming the wire WA even when placed in ahigh-temperature environment such as in a high-temperature storage testis used.

Accordingly, the metal film ME1 is made of one or more metals selectedfrom the group consisting of palladium (Pd), gold (Au), ruthenium (Ru),rhodium (Rh), platinum (Pt), and iridium (Ir) and can be a single-layerfilm made of a one-layer metal film or a laminated film including aplurality of metal films. When the metal film ME1 is a laminated film,each of the plurality of metal films included in the laminated film ismade of one or more metals selected from the group consisting ofpalladium (Pd), gold (Au), ruthenium (Ru), rhodium (Rh), platinum (Pt),and iridium (Ir). Most preferably, the metal film ME1 is a palladium(Pd) single-element film (single-layer film).

The barrier conductor film BR3 is a single-layer film or a laminatedfilm including at least one or more layers of films selected from thegroup consisting of a titanium (Ti) film, a titanium nitride (TiN) film,a tantalum (Ta) film, a tantalum nitride (TaN) film, a tungsten (W)film, a tungsten nitride (WN) film, a titanium-tungsten (TiW) film, anda tantalum-tungsten (TaW) film. Preferably, the barrier conductor filmBR3 includes a titanium (Ti) film and, over the titanium (Ti) film, themetal film ME1 is formed. Most preferably, the barrier conductor filmBR3 is a titanium (Ti) film.

FIG. 28 is a graph showing the result of a reliability test inaccordance with a high-temperature storage test at 200° C. The abscissaaxis of the graph in FIG. 28 corresponds to an elapsed time. Theordinate axis of the graph in FIG. 28 corresponds to the cumulativeprobability of the occurrence of a failure resulting from defectivecoupling of a copper wire. The graph in FIG. 28 shows the result ofperforming the reliability test in each of the first studied example(structure in FIG. 22), the second studied example (structure in FIG.26), and the present embodiment (structure in FIG. 9). Note that, inFIG. 28, in the case in the present embodiment (structure in FIG. 9), apalladium film is used as the metal film ME1, and a titanium film isused as the barrier conductor film BR3. Note that, to serve as anacceleration test, the reliability test is performed by producing asemiconductor package using a sealing resin containing Cl ions (or achloride) and SO₄ ions (or a sulfide) in a large quantity.

As can also be seen from the graph in FIG. 28, the result of thereliability test is most satisfactory in the present embodiment. Thatis, in the first studied example, a failure resulting from defectivecoupling of the copper wire is most likely to occur. In the secondstudied example, a failure resulting from defective coupling of thecopper wire is less likely to occur than in the first studied example,but more likely to occur than in the present embodiment. In the presentembodiment, a failure resulting from defective coupling of the copperwire is least likely to occur. A conceivable reason why the lifetime wasshort as a result of the reliability test in each of the first andsecond studied examples is that, as described above, in the region towhich the copper wire is bonded, the Cu₉Al₄ layer susceptible tocorrosion was generated in the first studied example, the (Cu, Pd)₉Al₄layer less susceptible to corrosion than Cu₉Al₄ but still having lowcorrosion resistance was generated in the second studied example, andthe corrosion of these layers caused the failures. In the presentembodiment, such a compound layer having low corrosion resistance wasnot generated and therefore it can be considered that, as the result ofthe reliability test, the lifetime was long.

Thus, in the present embodiment, in the reliability test in accordancewith the high-temperature storage test, the occurrence of a failureresulting from defective coupling of a wire can be suppressed (i.e., thelifetime can be elongated). Therefore, in the present embodiment, it ispossible to improve the reliability of the semiconductor device.

The barrier conductor film BR3 has the function of preventing Al formingthe Al-containing conductive film AM1 from being diffused into the metalfilm ME1. In view of this function, the thickness of the barrierconductor film BR3 is preferably not less than 5 nm. When the thicknessof the barrier conductor film BR3 is excessively large, a filmdeposition time increases to reduce the throughput of the semiconductordevice. Accordingly, the thickness of the barrier conductor film BR3 ismore preferably not more than 200 nm. Since the barrier conductor filmBR3 is harder than the metal film ME1, when the barrier conductor filmBR3 is excessively thick, a crack may be formed during wire bonding(during the coupling of the wire WA). From this viewpoint, the thicknessof the barrier conductor film BR3 is more preferably not more than 80nm. Thus, the thickness of the barrier conductor film BR3 is preferablyin the range of 5 to 200 nm, and most preferably in the range of 5 to 80nm. Note that the thickness of the barrier conductor film BR3 mentionedherein is the thickness of the barrier conductor film BR3 at the stagebefore wire bonding is performed (before the wire WA is coupled).However, since the thickness of the barrier conductor film BR3 afterwire bonding remains substantially unchanged from that before wirebonding, the thickness of the barrier conductor film BR3 mentionedherein can also be used even at the stage after wire bonding isperformed and consequently in the semiconductor device PKG. In addition,the preferred values (range) of the thickness of the barrier conductorfilm BR3 described herein are applicable to the thickness of the barrierconductor film BR2 in the second and third embodiments described later.This is because, in the second and third embodiments described later,the barrier conductor film BR3 is not provided and the barrier conductorfilm BR2 is provided with the function of the barrier conductor filmBR3.

In terms of ensuring the coupling strength of the wire WA, it ispreferable that, after wire bonding is performed, the metal film ME1 ispresent under the wire WA. However, when the thickness of the metal filmME1 is excessively small, during wire bonding, the wire WA may cutthrough the metal film ME1 and consequently the metal film ME1 may notbe interposed between the wire WA and the barrier conductor film BR3.Accordingly, the thickness of the metal film ME1 is preferably not lessthan 10 nm. This allows the metal film ME1 to be reliably present underthe wire WA after wire bonding is performed and consequently allows thecoupling strength of the wire WA to be easily ensured. When thethickness of the metal film ME1 is excessively large, the influence ofthe stress of the metal film ME1 may increase to possibly reduce thestrength of the pad PD including the barrier conductor film BR3, and themetal film ME1. In addition, a time required for depositing the metalfilm ME1 also undesirably increases. Accordingly, the thickness of themetal film ME1 is preferably not more than 200 nm. Thus, the thicknessof the metal film ME1 is preferably in the range of 10 to 200 nm. Notethat the thickness of the metal film ME1 mentioned herein is thethickness of the metal film ME1 at the stage before wire bonding isperformed (before the wire WA is coupled). Since the thickness of themetal film ME1 in the region other than the region to which the wire WAis coupled after wire bonding remains substantially unchanged from thatbefore wire bonding, the thickness of the metal film ME1 mentionedherein is applicable to the thickness of the metal film ME1 in theregion other than the region to which the wire WA is coupled at thestage after wire bonding is performed and consequently in thesemiconductor device PKG.

The thickness of the Al-containing conductive film AM1 is, e.g., about0.7 to 1.5 μm and can be selected from among various values inaccordance with a product.

In the semiconductor device PKG (PKG1 or PKG2) manufactured using thesemiconductor device (semiconductor chip) CP, at the junction interfacebetween the wire WA (copper wire) and the metal film ME1, a reactionlayer between the wire WA and the metal film ME1 may be formed. Thereaction layer is an intermetallic compound (or solid solution)containing Cu forming the wire WA and the metal element forming themetal film ME1 and corresponds to the CuPd layer formed at the junctioninterface between the Cu layer (wire WA) and the Pd layer (metal filmME1) in FIG. 24A described above. When wire bonding is performed, at thejunction interface between the wire WA (copper wire) and the metal filmME1, the reaction layer between the wire WA and the metal film ME1 isformed to be able to enhance the bonding strength of the wire WA.

Preferably, the metal film ME1 is formed by a sputtering method. Thereason for this is as follows.

The metal film ME1 can also be formed by a plating method. However, whenthe metal film ME1 is formed by a plating method, due to film depositionusing a plating solution, an organic component may be mixed in the metalfilm ME1 or contamination may be deposited on the top surface of themetal film ME. Since the top surface (upper surface) of the metal filmME1 forms a bonding surface (junction surface) to which the wire WA isbonded (joined), when an organic component is mixed in the metal filmME1 or contamination is deposited on the top surface of the metal filmME1, the strength of the bonding of the wire WA to the metal film ME1may decrease. When the metal film ME1 is formed by a plating method, theformed metal film ME1 is harder than when the metal film ME1 is formedby a sputtering method. However, when the metal film ME1 is hard, thestrength of the bonding of the wire WA to the metal film ME1 maydecrease.

By contrast, when the metal film ME1 is formed by a sputtering method,an impurity such as an organic component is less likely to be mixed inthe metal film ME1 and contamination is less likely to be deposited onthe top surface of the metal film ME1. In addition, the formed metalfilm ME1 is softer when the metal film ME1 is formed by a sputteringmethod than when the metal film ME1 is formed by a plating method.Moreover, the formed metal film ME1 is denser when the metal film ME1 isformed by a sputtering method than when the metal film ME1 is formed bya plating method. Accordingly, by forming the metal film ME1 by asputtering method, the strength of the bonding of the wire WA to themetal film ME1 can be improved. As a result, it is possible to improvethe reliability of the coupling of the wire WA and consequently improvethe reliability of the semiconductor package. In addition, a sputteringmethod allows a thin film to be formed more easily than by a platingmethod. Therefore, the metal film ME1 is more easily formed when formedby a sputtering method than when formed by a plating method.

More preferably, not only the metal film ME1, but also the barrierconductor film BR3 is formed by a sputtering method. By performing notonly the step of depositing the metal film ME1, but also the step ofdepositing the barrier conductor film BR3, the step of depositing thebarrier conductor film BR3 and the step of depositing the metal film ME1can efficiently be performed. For example, using the same sputteringapparatus, the step of depositing the barrier conductor film BR3 and thestep of depositing the metal film ME1 can continuously be performed.

<About First Modification>

FIG. 29 is a main-portion cross-sectional view of the semiconductordevice CP in a first modification of the present embodiment, whichcorresponds to FIG. 6 described above. FIG. 30 is a cross-sectional viewshowing the state where the wire WA is electrically coupled to the padPD shown in FIG. 29 described above, which corresponds to FIG. 9described above.

The semiconductor device CP in the first modification shown in FIGS. 29and 30 is different from the semiconductor device CP shown in each ofFIGS. 6 and 9 described above in that, in the case in the firstmodification, the barrier conductor film BR2 is formed over the entireupper surface of the Al-containing conductive film AM1 and, at thebottom portion of the opening OP, the barrier conductor film BR3 isformed not over the Al-containing conductive film AM1, but over thebarrier conductor film BR2 over the Al-containing conductive film AM1.The semiconductor device CP in the first modification shown in FIGS. 29and 30 is otherwise basically the same as the semiconductor device shownin each of FIGS. 6 and 9 described above.

The manufacturing process of the semiconductor device CP in the firstmodification shown in FIG. 29 is different from the manufacturingprocess of the semiconductor device CP in FIG. 6 described above in thefollowing point. Note that FIG. 31 is a main-portion cross-sectionalview of the semiconductor device in the first modification during themanufacturing process thereof, which corresponds to the same processstage as that in FIG. 17 described above.

In the first modification, in Step S24 (step of forming the opening OP)described above, the insulating film PA is etched using the foregoingphotoresist pattern RP2 as an etching mask such that the opening OP isformed therein. Thus, from the opening OP, the barrier conductor filmBR2 of the pad PD is exposed. At the stage where the barrier conductorfilm BR2 of the pad PD is exposed from the opening OP, etching is ended.That is, after the barrier conductor film BR2 is exposed from theopening OP and before the Al-containing conductive film AM1 is exposedfrom the opening OP, etching is ended. Accordingly, in the firstmodification, as shown in FIG. 31, even when the opening OP is formed inStep S24, at the bottom portion of the opening OP, the barrier conductorfilm BR2 remains over the Al-containing conductive film AM1 and theAl-containing conductive film AM1 is not exposed. When the barrierconductor film BR3 is formed in Step S25 described above, the barrierconductor film BR3 is formed over the insulating film PA including theside wall of the opening OP, and the upper surface of the pad PD (whichis the upper surface of the barrier conductor film BR2 herein) exposedfrom the opening OP. The manufacturing process is otherwise the same asdescribed above with reference to FIGS. 10 to 20 so that a repeateddescription thereof is omitted herein.

In the semiconductor device in the first modification, when the openingOP is formed in the insulating film PA in Step S24 described above, thebarrier conductor film BR2 need not be etched. This allows a reductionin the number of the process steps of manufacturing the semiconductordevice and a reduction in the time required for manufacturing thesemiconductor device. This also allows an improvement in the throughputof the semiconductor device.

Preferably, the barrier conductor film BR2 is made of a single-layerfilm or a laminated film including one or more layers of films selectedfrom the group consisting of a titanium (Ti) film, a titanium nitride(TiN) film, a tantalum (Ta) film, a tantalum nitride (TaN) film, atungsten (W) film, a tungsten nitride (WN) film, a titanium-tungsten(TiW) film, and a tantalum-tungsten (TaW) film. However, in view of thefunction of an antireflection film, as the barrier conductor film BR2, atitanium nitride (TiN) film is most preferred. As the barrier conductorfilm BR3, a titanium (Ti) film is preferably used.

<About Second Modification>

FIG. 32 is a main-portion cross-sectional view of the semiconductordevice CP in a second modification of the present embodiment, whichcorresponds to FIGS. 6 and 29 described above. FIG. 33 is across-sectional view showing the state where the wire WA is electricallycoupled to the pad PD shown in FIG. 32 described above, whichcorresponds to FIGS. 9 and 30 described above.

The semiconductor device CP shown in FIGS. 32 and 33 is different fromthe semiconductor device CP in the first modification shown in FIGS. 29and 30 described above in that, in the case in the second modificationshown in FIGS. 32 and 33, over the side wall of the opening OP of theinsulating film PA and over the upper surface of the insulating film PA,the barrier conductor film BR3 and the metal film ME1 are not formed.Consequently, in the semiconductor device CP in the second modificationshown in FIGS. 32 and 33, the laminated film including the barrierconductor film BR3, and the metal film ME1 over the barrier conductorfilm BR3 is formed locally over the pad PD exposed at the bottom portionof the opening OP. The semiconductor device CP in the secondmodification shown in FIGS. 32 and 33 is otherwise basically the same asthe semiconductor device CP in the first modification shown in FIGS. 29and 30 described above.

The manufacturing process of the semiconductor device CP in the secondmodification shown in FIG. 32 is different from the manufacturingprocess of the semiconductor device CP in the first modification shownin FIG. 29 described above in the following point. Note that FIG. 34 isa main-portion cross-sectional view of the semiconductor device in thesecond modification during the manufacturing process thereof, whichcorresponds to the same process stage as that in FIG. 19 describedabove.

That is, in the second modification, in Step S26 (step of patterning thelaminated film LM1 a) described above, the photoresist pattern RP3 isformed using a photolithographic technique and, as shown in FIG. 34, thetwo-dimensional shape and two-dimensional size (plane area) of thephotoresist pattern RP are set smaller than the two-dimensional shapeand two-dimensional size (plane area) of the opening OP. That is, thephotoresist pattern RP3 is caused to be included in the opening OP inplan view. As a result, when the laminated film LM1 is etched using thephotoresist pattern RP3 as an etching mask, from the side wall of theopening OP of the insulating film PA and from the upper surface of theinsulating film PA, the laminated film LM1 is removed. Consequently, thelaminated film LM1 remains over the pad PD exposed at the bottom portionof the opening OP. The manufacturing process is otherwise the same asthe manufacturing process of the semiconductor device in the firstmodification so that a repeated description thereof is omitted herein.

The second modification can also be applied to the semiconductor deviceCP in FIG. 6 described above. In that case, in the semiconductor devicein FIG. 6 described above, over the side wall of the opening OP of theinsulating film PA and over the upper surface of the insulating film PA,the barrier conductor film BR3 and the metal film ME1 are not formed. Asa result, the laminated film including the barrier conductor film BR3and the metal film ME1 over the barrier conductor film BR3 is formedlocally over the pad PD exposed at the bottom portion of the opening OP.

In the second modification, over the side wall of the opening OP of theinsulating film PA, the barrier conductor film BR3 and the metal filmME1 are not formed. Accordingly, in wire bonding, the barrier conductorfilm BR3 and the metal film ME1 each over the side wall of the openingOP do not interrupt wire bonding so that wire bonding is easilyperformed. That is, the wire bonding possible region in the pad PD isdefined by the opening OP and, when the barrier conductor film BR3 andthe metal film ME1 are formed over the side wall of the opening OP, theeffective area of the opening OP is accordingly reduced by thethicknesses of the films. In view of this, the second modification isapplied to the semiconductor device CP in FIG. 6 described above toprevent the barrier conductor film BR3 and the metal film ME1 from beingformed over the side wall of the opening OP of the insulating film PA.This allows the effective area of the opening OP to be increased to belarger than when the barrier conductor film BR3 and the metal film ME1are formed over the side wall of the opening OP of the insulating filmPA and allows an increase in the area of the wire bonding possibleregion in the pad PD. Accordingly, when the area of the opening OP isnot changed, the wire bonding step is easily performed. In addition,since the barrier conductor film BR3 and the metal film ME1 are notformed over the side wall of the opening OP of the insulating film PA,the area of the opening OP can be reduced advantageously for a reductionin the size (a reduction in the area) of the semiconductor device. Thisalso facilitates an increase in the number of pads and a reduction inthe pitch of the pads.

<About Third Modification>

FIGS. 35 to 38 are main-portion cross-sectional views of a semiconductordevice in a third modification during the manufacturing process thereof.

In the third modification, Steps S25 and S26 described above aredifferent from those in the manufacturing process in FIGS. 10 to 20described above. Note that the manufacturing process in the thirdmodification is also applicable to each of the manufacturing process inthe foregoing first modification and the manufacturing process in theforegoing second modification.

In the third modification, the manufacturing process is performed inaccordance with the manufacturing process shown in FIGS. 10 to 17described above up to Step S24 (the step of forming the opening OP)described above to obtain the structure in FIG. 17 described above. Notethat, in FIG. 17 described above, as described above, the barrierconductor film BR2 has been removed from the bottom portion of theopening OP so that the Al-containing conductive film AM1 is exposed atthe bottom portion of the opening OP. In another form, it is alsopossible that, in the third modification, the barrier conductor film BR2is not removed and is left at the bottom portion of the opening OP inthe same manner as in the foregoing first modification. In that case, asshown in FIG. 31 described above, not in FIG. 17 described above, thebarrier conductor film BR2 remains at the bottom portion of the openingOP.

Next, Step S25 described above is performed to successively form thebarrier conductor film BR3 and the metal film ME1 over the insulatingfilm PA including the side wall of the opening OP, and the upper surfaceof the pad PD exposed from the opening OP, which is the same as in thestep shown in FIG. 18 described above. However, the manufacturingprocess in the third modification is different from the manufacturingprocess shown in FIGS. 10 to 20 described above in that, as shown inFIG. 35, over the metal film ME1, a barrier conductor film BR4 isfurther formed.

That is, in the third modification, in Step S25 described above, notonly the barrier conductor film BR3 and the metal film ME1 over thebarrier conductor film BR3, but also the barrier conductor film BR4 overthe metal film ME1 is formed. Preferably, each of the barrier conductorfilm BR3, the metal film ME1, and the barrier conductor film BR4 isformed using a sputtering method. In the third modification, when StepS25 is performed, as shown in FIG. 35, a laminated film LM1 b includingthe barrier conductor film BR3, the metal film ME1 over the barrierconductor film BR3, and the barrier conductor film BR4 over the metalfilm ME1 is formed over the entire upper surface of the insulating filmPA including the side wall of the opening OP, and the upper surface ofthe pad PD exposed from the opening OP.

The barrier conductor film BR4 is a film to be used later as an etchingmask (hard mask). Preferably, the barrier conductor film BR4 is formedof the same material as that of the barrier conductor film BR3. Forexample, when the barrier conductor film BR3 is a titanium (Ti) film, itis preferable that the barrier conductor film BR4 is also a titanium(Ti) film.

The manufacturing process in the third modification is different fromthe manufacturing process shown in FIGS. 10 to 20 described above inStep S25 described above and subsequently performed.

First, over the laminated film LM1 b (more specifically, the barrierconductor film BR4 included in the laminated film LM1 b), thephotoresist pattern RP3 is formed using a photolithographic technique.FIG. 35 shows the resulting stage. Then, using the photoresist patternRP3 as an etching mask, the barrier conductor film BR4 included in thelaminated film LM1 b is etched. Thus, the portion of the barrierconductor film BR4 which is uncovered with the photoresist pattern RP3and exposed is etched and removed, while the portion of the barrierconductor film BR4 which is covered with the photoresist pattern RP3 isnot etched and remains. That is, the barrier conductor film BR4 ispatterned into substantially the same two-dimensional shape andtwo-dimensional size as those of the photoresist pattern RP3. In theregion uncovered with the photoresist pattern RP3 and exposed, the metalfilm ME1 is exposed as a result of the removal of the barrier conductorfilm BR4. Since the etching step is performed under etching conditionsunder which the metal film ME1 is less likely to be etched than thebarrier conductor film BR4, the metal film ME1 can be left in the regionuncovered with the photoresist pattern RP3 and exposed.

Next, the photoresist pattern RP3 is removed by ashing or the like. FIG.36 shows the resulting stage. In the region from which the photoresistpattern RP3 has been removed, the barrier conductor film BR4 havingsubstantially the same two-dimensional shape and two-dimensional size asthose of the photoresist pattern RP3 remains.

Next, as shown in FIG. 37, using the barrier conductor film BR4 as anetching mask (hard mask), the metal film ME1 is etched. As a result, theportion of the metal film ME1 which is uncovered with the barrierconductor film BR4 and exposed is etched and removed, while the portionof the metal film ME1 which is covered with the barrier conductor filmBR4 is not etched and remains. That is, the metal film ME1 is patternedinto the same two-dimensional shape and two-dimensional size as those ofthe barrier conductor film BR4 (and consequently those of thephotoresist pattern RP3). In the region uncovered with the barrierconductor film BR4 and exposed, the barrier conductor film BR3 isexposed as a result of the removal of the metal film ME1. When the metalfilm ME1 is etched using the barrier conductor film BR4 as an etchingmask, wet etching is more preferably used. The etching step is performedunder etching conditions under which the barrier conductor films BR3 andBR4 are less likely to be etched than the metal film ME1.

Next, as shown in FIG. 38, the barrier conductor film BR4 and theportion of the barrier conductor film BR3 which is uncovered with themetal film ME1 are removed by etching. At this time, when the barrierconductor films BR4 and BR3 have been formed of the same material, thebarrier conductor films BR4 and BR3 can be etched and removed by thesame etching step. The etching step is performed under etchingconditions under which the metal film ME1 is less likely to be etchedthan the barrier conductor films BR3 and BR4. Accordingly, as a resultof the etching and removal of the barrier conductor film BR4, the metalfilm ME1 is exposed, but is not etched and remains. On the other hand,the portion of the barrier conductor film BR3 which is uncovered withthe metal film ME1 is etched and removed, while the portion of thebarrier conductor film BR3 which is covered with the metal film ME1 isnot removed and remains. That is, the barrier conductor film BR3 ispatterned into substantially the same two-dimensional shape andtwo-dimensional size as those of the metal film ME1 (and consequentlythose of the photoresist pattern RP3).

When the barrier conductor film BR4 is formed of a material differentfrom that of the barrier conductor film BR3, it is also possible toremove the portion of the barrier conductor film BR3 which is uncoveredwith the laminated film including the metal film ME1, and the barrierconductor film BR4 by etching first, and then selectively remove thebarrier conductor film BR4.

Thus, the laminated film LM1 including the metal film ME1, and thebarrier conductor film BR3 under the metal film ME1, i.e., the laminatedfilm LM1 including the barrier conductor film BR3, and the metal filmME1 over the barrier conductor film BR3 is formed.

Subsequently, the back surface side of the foregoing semiconductorsubstrate SB is ground or polished as necessary to reduce the thicknessof the semiconductor substrate SB. Then, the semiconductor substrate SBis subjected to dicing together with the laminated structure over thesemiconductor substrate SB. In this manner, the semiconductor device CPcan be manufactured.

In the third modification, as can also be seen from FIGS. 36 and 37,when the metal film ME1 is etched to be patterned, the etching of themetal film ME1 is performed in the state where no photoresist pattern isformed over the metal film ME1. This can provide the followingadvantage.

That is, when the step of etching the metal film ME1 and the step ofetching the barrier conductor film BR3 are performed in the state wherethe photoresist pattern RP3 is formed over the metal film ME1, the topsurface of the metal film ME1 may be contaminated with an organicmaterial resulting from the photoresist pattern RP3. In the thirdmodification, by performing the step of etching the metal film ME1 andthe step of etching the barrier conductor film BR3 in the state where nophotoresist pattern is formed over the metal film ME1, it is possible toeliminate the possibility that the top surface of the metal film ME1 iscontaminated with an organic material resulting from the photoresistpattern. As a result, the wire bonding step is easily performed. Inaddition, process control is also easily performed.

When the step of etching the metal film ME1 is performed by wet etching,the metal film ME1 is easily removed. Therefore, the step of etching themetal film ME1 is more preferably performed by wet etching. However,when the wet etching is performed in the state where the photoresistpattern RP3 is formed, the photoresist pattern RP3 may possiblyswell/dissolve due to an organic additive in an etching solution in use.The possibility is particularly high in the etching solution used whenthe metal film ME1 is a palladium film. When the photoresist pattern RP3has swollen/dissolved, the shape of the processed laminated film LM maybe deformed so that the laminated film LM1 in a minute pattern is hardto form. An attempt to prevent this results in a narrower range ofoptions to choose an etching solution and difficult control of the stepof etching the metal film ME1.

By contrast, in the third modification, the step of etching the metalfilm ME1 and the step of etching the barrier conductor film BR3 areperformed in the state where no photoresist pattern is formed. Since thestep of etching the metal film ME1 is performed in the state where nophotoresist pattern is formed, even when wet etching is used in the stepof etching the metal film ME1, it is possible to prevent the photoresistpattern from swelling/dissolving due to the etching solution in use.This allows wet etching to be more readily used as the etching of themetal film ME1 and allows the laminated film LM1 to be more reliablyformed into an intended shape, while also allowing the laminated filmLM1 in a minute pattern to be more easily formed. This also widens therange of options to choose an etching solution to be used in the step ofetching the metal film ME1 and allows easy control of the step ofetching the metal film ME1.

<About Fourth Modification>

FIG. 39 is a main-portion cross-sectional view of the semiconductordevice CP in a fourth modification of the present embodiment, whichcorresponds to FIGS. 6, 29, and 32 described above.

In the semiconductor device CP in the fourth modification shown in FIG.39, as the insulating film PA, a laminated film including an insulatingfilm PA1 and an insulating film PA2 is used. The insulating film PA1 isin the lower layer, while the insulating film PA2 is in the upper layer.As the insulating film PA1, e.g., a silicon dioxide film can be used. Asthe insulating film PA2, e.g., a silicon nitride film can be used.

The manufacturing process of the semiconductor device CP in the fourthmodification shown in FIG. 39 is as follows.

That is, after the laminated film SM is patterned in Step S22 describedabove to form the pad PD as shown in FIG. 14 described above, theinsulating film PA1 is formed over the interlayer insulating film IL6 soas to cover the pad PD. Then, an opening OP1 is formed in the insulatingfilm PA1 to expose a part of the pad PD. At this time, the barrierconductor film BR2 is removed from the bottom portion of the opening OP1to expose the Al-containing conductive film AM1 included in the pad PDfrom the opening OP1. Then, over the insulating film PA1 including theinterior of the opening OP1, the insulating film PA2 is formed, andsubsequently the opening OP is formed in the insulating film PA2. Theopening OP is included in the opening OP1 in plan view. Thetwo-dimensional size (plane area) of the opening OP is smaller than thetwo-dimensional size (plane area) of the opening OP1. Thereafter, StepsS25 and S26 described above are performed to form the laminated film LM1including the barrier conductor film BR3, and the metal film ME1.

In the semiconductor device CP in the fourth modification thusmanufactured and shown in FIG. 39, in the portion of the pad PD which iscovered with the insulating film PA1, the barrier conductor film BR2remains over the Al-containing conductive film AM1 and, between theupper surface of the Al-containing conductive film AM1 and theinsulating film PA1, the barrier conductor film BR2 is interposed. Onthe other hand, in the portion of the pad PD which is covered with theinsulating film PA2 but uncovered with the insulating film PA1, thebarrier conductor film BR2 has been removed from over the Al-containingconductive film AM1. Between the upper surface of the Al-containingconductive film AM1 and the insulating film PA2, the barrier conductorfilm BR2 is not interposed. The configuration of the semiconductordevice CP in the fourth modification shown in FIG. 39 is otherwisebasically the same as that of the semiconductor device CP in FIG. 6described above so that a description thereof is omitted herein.

Note that in each of the first, second, and third modifications of thepresent embodiment and in each of the second and third embodimentsdescribed later, the insulating film PA used in the fourth modificationcan also be used.

Second Embodiment

FIG. 40 is a main-portion cross-sectional view of the semiconductordevice CP in the second embodiment, which corresponds to FIG. 6described above in the first embodiment described above or the like.FIG. 41 is a cross-sectional view showing the state where the wire WA iselectrically coupled to the pad PD shown in FIG. 40 described above,which corresponds to FIG. 9 described above in the first embodimentdescribed above or the like.

In the first embodiment described above, the barrier conductor films BR2and BR3 are separately formed. By contrast, in the second embodiment,the barrier conductive films BR2 and BR3 are formed as a common film.The following will describe the second embodiment with a focus on thedifference from The first embodiment described above, while omitting arepeated description of the same portion as in the first embodiment(including the foregoing first and fourth modifications) describedabove.

In the second embodiment, as shown in FIGS. 40 and 41, the pad PD isformed of a laminated film including the barrier conductor film BR1, theAl-containing conductive film AM1 over the barrier conductor film BR1,and the barrier conductor film BR2 over the Al-containing conductivefilm AM1. Note that, in the second embodiment, in the pad PD, thebarrier conductor film BR2 is formed over the entire upper surface ofthe Al-containing conductive film AM1. Accordingly, in the secondembodiment, each of the portion of the pad PD which is covered with theinsulating film PA and the portion of the pad PD which is uncovered withthe insulating film PA and exposed from the opening OP of the insulatingfilm PA is formed of the laminated film including the barrier conductorfilm BR1, the Al-containing conductive film AM1 over the barrierconductor film BR1, and the barrier conductor film BR2 over theAl-containing conductive film AM1. That is, the entire pad PD is formedof the laminated film including the barrier conductor film BR1, theAl-containing conductive film AM1 over the barrier conductor film BR1,and the barrier conductor film BR2 over the Al-containing conductivefilm AM1.

In the second embodiment, the metal film ME1 is formed, but theforegoing barrier conductor film BR3 is not formed. That is, in thesecond embodiment, over the portion of the pad which overlaps theopening OP in plan view (over the barrier conductor film BR2 herein),the metal film ME1 is formed. That is, over the portion of the barrierconductor film BR2 which overlaps the opening OP in plan view (i.e., theportion thereof exposed from the opening OP), the metal film ME1 isdirectly formed. The lower surface of the metal film ME1 is in contactwith the upper surface of the barrier conductor film BR2.

In the second embodiment, the foregoing barrier conductor film BR3 isnot formed since the barrier conductor film BR2 is provided with thefunction of the foregoing barrier conductor film BR3. Accordingly, thesecond embodiment uses, as the barrier conductor film BR2, a materialfilm which is usable as the foregoing barrier conductor film BR3 in thefirst embodiment described above. That is, in the second embodiment, thebarrier conductor film BR2 is a single-layer film or a laminated filmincluding one or more layers of films selected from the group consistingof a titanium (Ti) film, a titanium nitride (TiN) film, a tantalum (Ta)film, a tantalum nitride (TaN) film, a tungsten (W) film, a tungstennitride (WN) film, a titanium-tungsten (TiW) film, and atantalum-tungsten (TaW) film. Preferably, the barrier conductor film BR2includes a titanium (Ti) film and, over the titanium (Ti) film, themetal film ME1 is formed (so as to come in contact with the titaniumfilm). Most preferably, the barrier conductor film BR2 is a titanium(Ti) film.

The material of the metal film ME1 in the second embodiment is the sameas in the first embodiment so that a repeated description thereof isomitted herein.

Note that, in the case in FIGS. 40 and 41, over the side wall of theopening OP of the insulating film PA and over the upper surface of theinsulating film PA, the metal film ME1 is not formed. The metal film ME1is formed locally over the pad PD exposed at the bottom portion of theopening OP (over the barrier conductor film BR2 herein). As amodification of the second embodiment, in the same manner as in FIGS. 6and 9 described above in the first embodiment described above, the metalfilm ME1 can also be formed extensively over the pad PD exposed at thebottom portion of the opening OP of the insulating film PA (over thebarrier conductor film BR2 herein), the side wall of the opening OP ofthe insulating film PA, and the insulating film PA around the openingOP, as shown in FIGS. 42 and 43. FIG. 42 is a main-portioncross-sectional view of the modification of the semiconductor device CPin the second embodiment. FIG. 43 is a cross-sectional view showing thestate where the wire WA is electrically coupled to the pad PD shown inFIG. 42. However, when the metal film ME1 is not formed over the sidewall of the opening OP of the insulating film PA as in FIGS. 40 and 41,the same effect as described in the foregoing second modification (FIGS.32 to 34) of the first embodiment described above can be obtained.

To the pad PD, the wire WA (copper wire) is electrically coupled. Ineither of the cases in FIGS. 40 and 42, over the portion of theAl-containing conductive film AM1 which overlaps the opening OP in planview, the barrier conductor film BR2 and the metal film ME1 over thebarrier conductor film BR2 are formed. Accordingly, in the secondembodiment also, in wire bonding, the wire WA comes into contact withthe outermost metal film ME1 in the same manner as in the firstembodiment described above. As shown in FIGS. 41 and 43, the wire WA iscoupled to the metal film ME1. As a result, after the wire WA iselectrically coupled to the pad PD, as shown in FIGS. 41 and 43, thelaminated film including the barrier conductor film BR2, and the metalfilm ME1 over the barrier conductor film BR2 is interposed between theAl-containing conductive film AM1 included in the pad PD and the wireWA.

Next, a description will be given of the manufacturing process of thesemiconductor device in the second embodiment. FIGS. 44 to 47 aremain-portion cross-sectional views of the semiconductor device in thesecond embodiment during the manufacturing process thereof and showcross-sectional views of a region corresponding to FIG. 40 describedabove.

In the second embodiment also, in the same manner as in the firstembodiment described above, the manufacturing process is performed up toStep S23 (step of forming the insulating film PA) described above toobtain the structure in FIG. 15 described above.

Next, as shown in FIG. 44, in Step S24 described above, the opening OPis formed in the insulating film PA. However, in the second embodiment,in the same manner as in the foregoing first modification of the firstembodiment described above, the insulating film PA is etched using theforegoing photoresist pattern RP2 as an etching mask to form the openingOP in the insulating film PA and expose the barrier conductor film BR2of the pad PD from the opening OP. However, at the stage where thebarrier conductor film BR2 of the pad PD is exposed from the opening OP,etching is ended. That is, after the barrier conductor film BR2 isexposed from the opening OP and before the Al-containing conductive filmAM1 is exposed from the opening OP1, the etching is ended. Consequently,as can also be seen from FIG. 44, even when the opening OP is formed inStep S24, at the bottom portion of the opening OP, the barrier conductorfilm BR2 remains over the Al-containing conductive film AM1 so that theAl-containing conductive film AM1 is not exposed.

In the present embodiment, in Step S24, the barrier conductor film BR2is left at the bottom portion of the opening OP, as shown in FIG. 44.Accordingly, compared to the case where the barrier conductor film BR2is removed from the bottom portion of the opening OP as shown in FIG. 17described above, the thickness of the barrier conductor film BR2 formedin Step S21 described above is preferably increased. This allows thebarrier conductor film BR2 to easily remain at the bottom portion of theopening OP in Step S24.

Next, a step corresponding to Step S25 described above is performed. Thestep corresponding to Step S25 in the second embodiment is differentfrom Step S25 in the first embodiment described above. That is, in thesecond embodiment, the step of forming the metal film ME1 is performedwithout forming the foregoing barrier conductor film BR3. That is, fromStep S25 described above, the second embodiment omits the step offorming the barrier conductor film BR3 and performs the step of formingthe metal film ME1. As a result, as shown in FIG. 45, over theinsulating film PA including the side wall of the opening OP, and theupper surface of the pad PD (which is the upper surface of the barrierconductor film BR2 herein) exposed from the opening OP, the metal filmME1 is formed. Preferably, the metal film ME1 is formed using asputtering method. At this stage, the metal film ME1 is formed over theentire upper surface of the insulating film PA including the side wallof the opening OP, and the upper surface of the pad PD (which is theupper surface of the barrier conductor film BR2 herein) exposed from theopening OP.

Next, the step corresponding to Step S26 described above is performed.The step corresponding to Step 26 in the second embodiment is differentfrom Step 26 in the first embodiment described above. That is, in thefirst embodiment described above, the laminated film LM1 a including thebarrier conductor film BR3, and the Al-containing conductive film AM1 ispatterned in Step S26. By contrast, in the second embodiment, thebarrier conductor film BR3 is not formed and therefore the metal filmME1 is patterned.

Specifically, as shown in FIG. 46, over the metal film ME1, thephotoresist pattern RP3 is formed using a photolithographic technique.Then, using the photoresist pattern RP3 as an etching mask, the metalfilm ME1 is etched. As a result, the metal film ME1 is patterned.Thereafter, the photoresist pattern RP3 is removed. FIG. 47 shows theresulting stage.

Subsequent, the back surface side of the foregoing semiconductorsubstrate SB is ground or polished as necessary to reduce the thicknessof the semiconductor substrate SB. Then, the semiconductor substrate SBis subjected to dicing together with the laminated structure over thesemiconductor substrate SB. In this manner, the semiconductor device CPcan be manufactured.

Next, a description will be given of a modification of the manufacturingprocess of the semiconductor device in the second embodiment. FIGS. 48to 52 are main-portion cross-sectional views of the semiconductor devicein the modification of the second embodiment during the manufacturingprocess thereof and show the cross-sectional views of a regioncorresponding to FIG. 40 described above.

After performing the manufacturing process up to the step of forming themetal film ME1 and obtaining the structure shown in FIG. 45 describedabove, as shown in FIG. 48, a barrier conductor film BR5 is formed overthe metal film ME1. This provides the state where a laminated filmincluding the metal film ME1, and the barrier conductor film BR5 overthe metal film ME1 is formed over the entire upper surface of theinsulating film PA including the side wall of the opening OP, and theupper surface of the pad PD (which is the upper surface of the barrierconductor film BR2 herein) exposed from the opening OP. The barrierconductor film BR5 is a film to be used later as an etching mask (hardmask). The barrier conductor film BR5 is made of a material differentfrom that of the metal film ME1. Preferably, the barrier conductor filmBR5 is made of a material which easily ensures the etching selectivityto the metal film ME1 and is easily removed later by etching. As thebarrier conductor film BR5, e.g., a titanium (Ti) film can be usedappropriately.

Next, as shown in FIG. 49, over the barrier conductor film BR5, using aphotolithographic technique, the photoresist pattern RP3 is formed.Then, using the photoresist pattern PR3 as an etching mask, the barrierconductor film BR5 is etched. As a result, the portion of the barrierconductor film BR5 which is uncovered with the photoresist pattern RP3and exposed is etched and removed, while the portion of the barrierconductor film BR5 which is covered with the photoresist pattern RP3 isnot etched and remains. That is, the barrier conductor film BR5 ispatterned into substantially the same two-dimensional shape andtwo-dimensional size as those of the photoresist pattern RP3. In theregion uncovered with the photoresist pattern RP3 and exposed, the metalfilm ME1 is exposed as a result of the removal of the barrier conductorfilm BR5. Since the etching step is performed under etching conditionsunder which the metal film ME1 is less likely to be etched than thebarrier conductor film BR5, in the region uncovered with the photoresistpattern RP3 and exposed, the metal film ME1 can be left.

Next, the photoresist pattern RP3 is removed by ashing or the like. FIG.50 shows the resulting stage. In the region from which the photoresistpattern RP3 has been removed, the barrier conductor film BR5 havingsubstantially the same two-dimensional shape and two-dimensional size asthose of the photoresist pattern RP3 remains.

Next, using the barrier conductor film BR5 as an etching mask (hardmask), the metal film ME1 is etched. As a result, as shown in FIG. 51,the portion of the metal film ME1 which is uncovered with the barrierconductor film BR5 and exposed is etched and removed, while the portionof the metal film ME1 which is covered with the barrier conductor filmBR5 is not etched and remains. That is, the metal film ME1 is patternedinto substantially the same two-dimensional shape and two-dimensionalsize of those of the barrier conductor film BR5 (and consequently thoseof the photoresist pattern RP3). When the metal film ME1 is etched usingthe barrier conductor film BR5 as an etching mask, wet etching is usedpreferably. The etching step is performed under etching conditions underwhich the barrier conductor film BR5 is less likely to be etched thanthe metal film ME1.

Next, the barrier conductor film BR5 remaining over the metal film ME1is removed by etching. FIG. 52 shows the resulting stage. The etchingstep is performed under etching conditions under which the metal filmME1 is less likely to be etched than the barrier conductor film BR5.Thus, the barrier conductor film BR5 is etched and removed to expose thetop surface of the metal film ME1, while the metal film ME1 is notremoved and remains.

Subsequently, the back surface side of the foregoing semiconductorsubstrate SB is ground or polished as necessary to reduce the thicknessof the semiconductor substrate SB. Then, the semiconductor substrate SBis subjected to dicing together with the laminated structure over thesemiconductor substrate SB. In this manner, the semiconductor device CPcan be manufactured.

In the second embodiment also, substantially the same effect as obtainedin the first embodiment described above can be obtained.

However, in the second embodiment, the barrier conductor film BR2included in the pad PD formed in Steps S25 and S26 is provided with thefunction of the barrier conductor film BR3 in the first embodimentdescribed above. As a result, Embodiment does not need the step offorming the barrier conductor film BR3 and can accordingly reduce thenumber of the process steps of manufacturing the semiconductor device.

On the other hand, in the first embodiment described above, the barrierconductor film BR3 is formed separately from the barrier conductor filmBR2 included in the pad PD formed in Steps S25 and 26. Accordingly, inthe first embodiment described above, it is possible to choose, for thebarrier conductor film BR2, a material film which is appropriate interms of patterning a laminated conductive film (which is the foregoinglaminated film SM herein) and forming the pad PD without caring aboutthe function required of the barrier conductor film BR3. For example, itis possible to form the barrier conductor films BR2 and BR3 of differentmaterials. This widens the range of options to choose the barrierconductor film BR2 and allows easy formation of the pad PD.

Also, in the first embodiment described above, after the formation ofthe pad PD, the insulating film PA and the opening OP are formed, andthen the laminated film LM1 including the barrier conductor film BR3,and the metal film ME1 is formed. This allows the laminated film LM1including the barrier conductor film BR3, and the metal film ME1 to beformed only in those of products manufactured by the commonmanufacturing process to which copper wires are coupled (particularly,those products intended to have higher reliability of the coupling tothe copper wires). As a result, it is possible to use a commonmanufacturing process for products having different specifications andthus reduce the manufacturing cost of the semiconductor devices.

Third Embodiment

FIG. 53 is a main-portion cross-sectional view of the semiconductordevice CP in the third embodiment, which corresponds to FIG. 6 describedabove in the first embodiment described above or the like. FIG. 54 is across-sectional view showing the state where the wire WA is electricallycoupled to the pad PD shown in FIG. 53 described above and correspondsto FIG. 9 described above in the first embodiment described above or thelike.

In each of the first and second embodiments described above, the metalfilm ME1 is formed over the portion of the pad PD which overlaps theopening OP in plan view, while the metal film ME1 is not formed over theportion of the pad which is covered with the insulating film PA. Bycontrast, in the semiconductor device in the third embodiment, as shownin FIGS. 53 and 54, the metal film ME1 is formed over the entire uppersurface of the pad PD.

The following will describe The third embodiment with a focus on thedifference from The first embodiment, while omitting a repeateddescription of the same portion as in the first embodiment (includingthe foregoing first and fourth modifications) described above.

As shown in FIGS. 53 and 54, in the semiconductor device CP in the thirdembodiment, the metal film ME1 is formed over the entire upper surfaceof the pad PD. Specifically, the metal film ME1 is formed over theentire upper surface of the pad PD made of a laminated film includingthe barrier conductor film BR1, the Al-containing conductive film AM1over the barrier conductor film BR1, and the barrier conductor film BR2over the Al-containing conductive film AM1.

The metal film ME1 can also be regarded as a part of the pad PD.Accordingly, in the third embodiment, it can be considered that the padPD is formed of a laminated film including the barrier conductor filmBR1, the Al-containing conductive film AM1 over the barrier conductorfilm BR1, the barrier conductor film BR2 over the Al-containingconductive film AM1, and the metal film ME1 over the barrier conductorfilm BR2. That is, the pad PD is made of the patterned laminated filmand, in the third embodiment, the laminated film includes the barrierconductor film BR1, the Al-containing conductive film AM1 over thebarrier conductor film BR1, the barrier conductor film BR2 over theAl-containing conductive film AM1, and the metal film ME1 over thebarrier conductor film BR2.

As a result, in the third embodiment, each of the portion of the pad PDwhich is covered with the insulating film PA and the portion of the padPD which is uncovered with the insulating film PA and exposed from theopening OP of the insulating film PA is formed of the laminated filmincluding the barrier conductor film BR1, the Al-containing conductivefilm AM1 over the barrier conductor film BR1, the barrier conductor filmBR2 over the Al-containing conductive film AM1, and the metal film ME1over the barrier conductor film BR2. That is, the entire pad PD isformed of the laminated film including the barrier conductor film BR1,the Al-containing conductive film AM1 over the barrier conductor filmBR1, the barrier conductor film BR2 over the Al-containing conductivefilm AM1, and the metal film ME1 over the barrier conductor film BR2.Note that, in the third embodiment, over the side wall of the opening OPof the insulating film PA and the upper surface of the insulating filmPA, the metal film ME1 is not formed.

In the third embodiment, over the entire upper surface of theAl-containing conductive film AM1 forming the pad PD, the laminated filmincluding the barrier conductor film BR2, and the metal film ME1 overthe barrier conductor film BR2 is formed. To the pad PD, the wire WA(copper wire) is electrically coupled and, in the same manner as in thefirst and second embodiments described above, in the third embodimentalso, the wire WA comes in contact with the outermost metal film ME1 inwire bonding to be coupled to the metal film ME1. Consequently, afterthe wire WA is electrically coupled to the pad PD, between theAl-containing conductive film AM1 included in the pad PD and the wireWA, the laminated film including the barrier conductor film BR2, and themetal film ME1 over the barrier conductor film BR2 is interposed.

In the third embodiment, the foregoing barrier conductor film BR3 is notformed since the barrier conductor film BR2 is provided with thefunction of the foregoing barrier conductor film BR3. Accordingly, thethird embodiment uses, as the barrier conductor film BR2, a materialfilm which is usable as the foregoing barrier conductor film BR3 in thefirst embodiment described above. That is, in the third embodiment, thebarrier conductor film BR2 is a single-layer film or a laminated filmincluding one or more layers of films selected from the group consistingof a titanium (Ti) film, a titanium nitride (TiN) film, a tantalum (Ta)film, a tantalum nitride (TaN) film, a tungsten (W) film, a tungstennitride (WN) film, a titanium-tungsten (TiW) film, and atantalum-tungsten (TaW) film. Preferably, the barrier conductor film BR2includes a titanium (Ti) film and, over the titanium (Ti) film, themetal film ME1 is formed (so as to come in contact with the titaniumfilm). Most preferably, the barrier conductor film BR2 is a titanium(Ti) film.

The material of the metal film ME1 in the third embodiment is the sameas in the first embodiment so that a repeated description thereof isomitted here.

Also, in the third embodiment, the pad PD is covered with the insulatingfilm PA except in the region which overlaps the opening OP in plan view.In another embodiment, it may also be possible to omit the formation ofthe insulating film PA. In the case where the formation of theinsulating film PA is omitted, in FIG. 53, the entire upper surface ofthe pad PD and the side wall (side surface) thereof are consequentlyexposed. It may also be possible to omit the formation of the insulatingfilm PA in each of the first and second embodiments described above.

Next, a description will be given of the manufacturing process of thesemiconductor device in the third embodiment. FIGS. 55 to 59 aremain-portion cross-sectional views of the semiconductor device in thethird embodiment during the manufacturing process thereof and showcross-sectional views of a region corresponding to FIG. 53 describedabove.

In the third embodiment, in the same manner as in the first embodimentdescribed above, in Step S21 described above, the barrier conductor filmBR1, the Al-containing conductive film AM1, and the barrier conductorfilm BR2 are successively formed to provide the structure in FIG. 12described above. Then, in the third embodiment, as shown in FIG. 55, themetal film ME1 is formed over the barrier conductor film BR2. Thus, overthe interlayer insulating film IL6 in which the foregoing via portion V5(not shown in FIG. 55) is embedded, the laminated film SM1 including thebarrier conductor film BR1, the Al-containing conductive film AM1 overthe barrier conductor film BR1, the barrier conductor film BR2 over theAl-containing conductive film AM1, and the metal film ME1 over thebarrier conductor film BR2 is formed. Each of the barrier conductor filmBR1, the Al-containing conductive film AM1, the barrier conductor filmBR2, and the metal film ME1 can be formed using a sputtering method orthe like. The step of forming the metal film ME1 can also be performedcontinuously after the step of forming the barrier conductor film BR2.

Next, in Step S22 described above, using a photolithographic techniqueand an etching technique, the laminated film SM1 is patterned to formthe pad PD. The third embodiment is different from the first embodimentdescribed above in that the laminated film SM1 to be patterned alsoincludes the metal film ME1.

Specifically, as shown in FIG. 56, over the laminated film SM1, thephotoresist pattern RP1 is formed using a photolithographic technique.Then, using the photoresist pattern RP1 as an etching mask, thelaminated film SM1 is etched. The step of etching the laminated film SM1includes the step of etching the metal film ME1, the step of etching thebarrier conductor film BR2, the step of etching the Al-containingconductive film AM1, and the step of etching the barrier conductor filmBR1. By the etching, the laminated film SM1 is patterned to form the padPD made of the patterned laminated film SM1. Thereafter, the photoresistpattern RP1 is removed. FIG. 57 shows the resulting stage. Thus, thepatterning step in Step S22 is performed. Note that, when the laminatedfilm SM1 is patterned, not only the pad PD, but also the wires in thesame layer as that of the pad PD can also be formed.

Next, in Step S23 described above, in the same manner as in the firstembodiment described above, in the third embodiment also, the insulatingfilm PA is formed over the interlayer insulating film IL6 so as to coverthe pad PD, as shown in FIG. 58.

Next, in Step S24 described above, as shown in FIG. 59, the opening OPis formed in the insulating film PA. However, in the third embodiment,using the foregoing photoresist pattern RP2 (not shown in FIG. 59)formed over the insulating film PA as an etching mask, the insulatingfilm PA is etched such that the opening OP is formed therein to exposethe metal film ME1 of the pad PD. At the stage where the metal film ME1of the pad PD is exposed from the opening OP, the etching is ended. Thatis, after the metal film ME1 is exposed from the opening OP and beforethe barrier conductor film BR2 is exposed from the opening OP, etchingis ended. Consequently, as shown in FIG. 59, even when the opening OP isformed in Step S24, at the bottom portion of the opening OP, the barrierconductor film BR2 and the metal film ME1 over the barrier conductorfilm BR2 remain over the Al-containing conductive film AM1 so that theAl-containing conductive film AM1 and the barrier conductor film BR2 arenot exposed.

Thereafter, in the third embodiment, Steps S25 and S26 described aboveare not performed. This is because the pad PD already has the metal filmME1 in the uppermost layer thereof.

Subsequently, the back surface side of the foregoing semiconductorsubstrate SB is ground or polished as necessary to reduce the thicknessof the semiconductor substrate SB. Then, the semiconductor substrate SBis subjected to dicing together with the laminated structure over thesemiconductor substrate SB. In this manner, the semiconductor device CPcan be manufactured.

Next, a description will be given of a modification of the manufacturingprocess of the semiconductor device in the third embodiment. FIGS. 60 to64 are main-portion cross-sectional views of the semiconductor device inthe modification of the third embodiment during the manufacturingprocess thereof and show cross-sectional views of a region correspondingto FIG. 53 described above.

In the same manner as in the first embodiment described above, in StepS21 described above, the barrier conductor film BR1, the Al-containingconductive film AM1, and the barrier conductor film BR2 are successivelyformed to provide the structure in FIG. 12 described above. Then, asshown in FIG. 60, the metal film ME1 is formed over the barrierconductor film BR2, and then a barrier conductor film BR6 is formed overthe metal film ME1. Thus, over the interlayer insulating film IL6 inwhich the foregoing via portion V5 (not shown in FIG. 60) is embedded, alaminated film SM2 including the barrier conductor film BR1, theAl-containing conductive film AM1 over the barrier conductor film BR1,the barrier conductor film BR2 over the Al-containing conductive filmAM1, the metal film ME1 over the barrier conductor film BR2, and thebarrier conductor film BR6 over the metal film ME1 is formed. Each ofthe barrier conductor film BR1, the Al-containing conductive film AM1,the barrier conductor film BR2, the metal film ME1, and the barrierconductor film BR6 can be formed using a sputtering method or the like.The step of forming the metal film ME1 can also be performedcontinuously after the step of forming the barrier conductor film BR2.The step of forming the barrier conductor film BR6 can also be performedcontinuously after the step of forming the metal film ME1

The barrier conductor film BR6 is a film to be used later as an etchingmask (hard mask). The barrier conductor film RR6 is made of a materialdifferent from that of the metal film ME1. Preferably, the barrierconductor film RR6 is made of a material which easily ensures theetching selectivity to the metal film ME1 and is easily removed later byetching. As the barrier conductor film RR6, e.g., a titanium nitride(TiN) film can be used appropriately.

Next, as shown in FIG. 61, over the barrier conductor film RR6, using aphotolithographic technique, the photoresist pattern RP1 is formed.Then, using the photoresist pattern PR1 as an etching mask, the barrierconductor film RR6 is etched. As a result, the portion of the barrierconductor film RR6 which is uncovered with the photoresist pattern RP1and exposed is etched and removed, while the portion of the barrierconductor film RR6 which is covered with the photoresist pattern RP1 isnot etched and remains. That is, the barrier conductor film RR6 ispatterned into substantially the same two-dimensional shape andtwo-dimensional size as those of the photoresist pattern RP1. In theregion uncovered with the photoresist pattern RP1 and exposed, the metalfilm ME1 is exposed as a result of the removal of the barrier conductorfilm RR6. Since the etching step is performed under etching conditionsunder which the metal film ME1 is less likely to be etched than thebarrier conductor film RR6, in the region uncovered with the photoresistpattern RP1 and exposed, the metal film ME1 can be left.

Next, the photoresist pattern RP1 is removed by ashing or the like. FIG.62 shows the resulting stage. In the region from which the photoresistpattern RP1 has been removed, the barrier conductor film RR6 havingsubstantially the same two-dimensional shape and two-dimensional size asthose of the photoresist pattern RP1 remains.

Next, using the barrier conductor film BR6 as an etching mask (hardmask), the metal film ME1 is etched. As a result, as shown in FIG. 63,the portion of the metal film ME1 which is uncovered with the barrierconductor film BR6 and exposed is etched and removed, while the portionof the metal film ME1 which is covered with the barrier conductor filmBR6 is not etched and remains. That is, the metal film ME1 is patternedinto substantially the same two-dimensional shape and two-dimensionalsize of those of the barrier conductor film BR6 (and consequently thoseof the photoresist pattern RP1). When the metal film ME1 is etched usingthe barrier conductor film BR6 as an etching mask, wet etching is usedpreferably. The etching step is performed under etching conditions underwhich the barrier conductor film BR6 is less likely to be etched thanthe metal film ME1.

Next, as shown in FIG. 64, the respective portions of the barrierconductor film BR2, the Al-containing conductive film AM1, and thebarrier conductor film BR1 which are uncovered with the metal film ME1are removed by etching. At this time, at the stage where the barrierconductor film BR6 remains over the metal film ME1, the barrierconductor film BR6 functions as an etching mask (hard mask). However,when the barrier conductor film BR6 is removed by etching, the metalfilm ME1 can function as an etching mask (hard mask). Accordingly, whilethe portion of the barrier conductor film BR2 which is uncovered withthe metal film ME1 is etched, the etching is performed under etchingconditions under which the metal film ME1 is less likely to be etchedthan the barrier conductor film BR2. While the portion of theAl-containing conductive film AM1 which is uncovered with the metal filmME1 is etched, the etching is performed under etching conditions underwhich the metal film ME1 is less likely to be etched than theAl-containing conductive film AM1. While the portion of the barrierconductor film BR1 which is uncovered with the metal film ME1 is etched,the etching is performed under etching conditions under which the metalfilm ME1 is less likely to be etched than the barrier conductor filmBR1.

The barrier conductor film BR6 is etched and removed while therespective portions of the barrier conductor film BR2, the Al-containingconductive film AM1, and the barrier conductor film BR1 which areuncovered with the metal film ME1 are etched. After the respectiveportions of the barrier conductor film BR2, the Al-containing conductivefilm AM1, and the barrier conductor film BR1 which are uncovered withthe metal film ME1 are etched, when the barrier conductor film BR6remains over the metal film ME1, the step of selectively removing thebarrier conductor film BR6 may appropriately be performed additionallythereafter. Of the metal film ME1 and the barrier conductor film BR2,the Al-containing conductive film AM1, and the barrier conductor filmBR1 each remaining under the metal film ME1, the pad PD is formed.

In this manner, the laminated film SM2 is patterned to form the pad PD.

The subsequent steps are the same as those described above withreference to FIGS. 58 and 59 so that a repeated description thereof isomitted herein.

In the third embodiment also, substantially the same effects as thoseobtained in the first and second embodiments described above can beobtained.

However, in the third embodiment, at the stage where the laminatedconductive film (which is the foregoing laminated film SM1 herein) ispatterned to form the pad PD, the metal film ME1 is formed in theuppermost layer of the pad PD. This eliminates the need to form thebarrier conductor film BR3 and the metal film ME1 again after theformation of the pad PD. Thus, it is possible to simplify themanufacturing process of the semiconductor device. Accordingly, in termsof maximally simplifying the manufacturing process of the semiconductordevice, the third embodiment is advantageous. In the third embodiment,it is possible to simplify the manufacturing process of thesemiconductor device and reduce the number of manufacturing processsteps. This can reduce the manufacturing cost of the semiconductordevice. This can also reduce the time required for manufacturing thesemiconductor device and improve the throughput thereof.

Also, in the third embodiment, in the portion of the pad PD which iscovered with the insulating film PA, the metal film ME1 is in theuppermost layer. Consequently, the insulating film PA comes in contactwith the upper surface of the metal film ME1. On the other hand, in thefirst and second embodiments described above, in the portion of the padPD which is covered with the insulating film PA, the barrier conductorfilm BR2 is in the uppermost layer. Consequently, the insulating film PAcomes in contact with the upper surface of the barrier conductor filmBR2. Accordingly, in terms of improving the adhesion of the insulatingfilm PA to the pad PD, the first and second embodiments described aboveare advantageous. In the first and second embodiments described above,it is possible to improve the adhesion of the insulating film PA to thepad PD and thus more reliably prevent the insulating film PA frompeeling.

The first to third embodiments (including the modifications of eachthereof) described above can be described as follows when viewed in acomprehensive perspective.

That is, the semiconductor device CP has the pad PD to which a copperwire (corresponding to the wire WA) is to be electrically coupled. Thepad PD has the Al-containing conductive film AM1 containing aluminum asa main component. In the region to which the copper wire is coupled(from another perspective, the region overlapping the opening OP in planview), over the Al-containing conductive film AM1, a first laminatedfilm including a first conductor film, and a second conductive film overthe first conductor film is formed. The second conductor film is in theuppermost layer. Here, the second conductor film corresponds to theforegoing metal film ME1. The first conductor film corresponds to theforegoing barrier conductor film BR3 (or the laminated film includingthe barrier conductor films BR2 and BR3) in the first embodimentdescribed above, while corresponding to the foregoing barrier conductorfilm BR2 in the second and third embodiments described above.

The semiconductor device PKG (PKG1 or PKG2) includes the semiconductordevice (semiconductor chip) CP having the pad PD, the wire WA (copperwire) electrically coupled to the pad PD of the semiconductor device CP,and the sealing resin portion (sealing portion MR1 or MR2) sealingtherein the semiconductor device CP and the wire WA. The pad PD includesthe Al-containing conductive film AM1 containing aluminum as a maincomponent. Between the wire WA and the Al-containing conductive filmAM1, the first laminated film including the first conductor film, andthe second conductor film over the first conductor film is interposed.The wire WA is bonded to the second conductor film. Here, the secondconductor film corresponds to the foregoing metal film ME1. The firstconductor film corresponds to the foregoing barrier conductor film BR3(or the laminated film including the barrier conductor films BR2 andBR3) in the first embodiment described above, while corresponding to theforegoing barrier conductor film BR2 in the second and third embodimentsdescribed above.

The first conductor film is a single-layer film or a laminated filmincluding one or more layers of films selected from the group consistingof a titanium film, a titanium nitride film, a tantalum film, a tantalumnitride film, a tungsten film, a tungsten nitride film, atitanium-tungsten film, and a tantalum-tungsten film. The secondconductor film (i.e., the metal film ME1) is made of one or more metalsselected from the group consisting of palladium (Pd), gold (Au),ruthenium (Ru), rhodium (Rh), platinum (Pt), and iridium (Ir).

Most preferably, the second conductor film (metal film ME1) is apalladium (Pd) film. Preferably, the first conductor film includes atitanium film and, over the titanium film, the second conductor film(metal film ME1) is formed. Most preferably, the first conductor film isa titanium film. The titanium film has an excellent barrier property(diffusion preventing function) against Al and also has excellentadhesion to a palladium film. Accordingly, the palladium film as thesecond conductor film (metal film ME1) is preferably formed on thetitanium film (so as to come in contact with the titanium film).

In each of the first and second embodiments described above, over theportion of the Al-containing conductive film AM1 which is covered withthe insulating film PA (second insulating film), the laminated filmincluding the first conductor film, and the second conductor film overthe first conductor film is not formed. In the third embodimentdescribed above, the laminated film including the first conductor film,and the second conductor film over the first conductor film is formedover the entire upper surface of the Al-containing conductive film AM1included in the pad PD.

The manufacturing process of the semiconductor device in each of thefirst to third embodiments (including the modifications of each thereof)described above can be described as follows when viewed in acomprehensive perspective.

The method of manufacturing the semiconductor device includes the stepsof: (a) providing the semiconductor substrate SB; (b) forming, over themain surface the semiconductor substrate SB, a first insulating film(corresponding to the interlayer insulating film IL6); and (c) forming,over the first insulating film, the Al-containing conductive film AM1containing aluminum as a main component. The method of manufacturing thesemiconductor device further includes the steps of: (d) patterning theAl-containing conductive film AM1 to form the pad PD; (e) forming, overthe first insulating film, a second insulating film (corresponding tothe insulating film PA) so as to cover the pad PD therewith; (f) formingthe opening OP in the second insulating film; and (g) electricallycoupling a copper wire (corresponding to the wire WA) to the pad PDexposed from the opening OP. The method of manufacturing thesemiconductor device further includes the steps of: (h) after the step(c) and before the step (g), forming a first conductor film over theAl-containing conductive film AM1; and (i) after the step (h) and beforethe step (g), forming a second conductor film over the first conductorfilm. Here, the second conductor film corresponds to the foregoing metalfilm ME1. The first conductor film corresponds to the foregoing barrierconductor film BR3 in the first embodiment described above, whilecorresponding to the foregoing barrier conductor film BR2 in the secondand third embodiments described above. The first conductor film is asingle-layer film or a laminated film including one or more layers offilms selected from the group consisting of a titanium film, a titaniumnitride film, a tantalum film, a tantalum nitride film, a tungsten film,a tungsten nitride film, a titanium-tungsten film, and atantalum-tungsten film. The second conductor film is made of one or moremetals selected from the group consisting of palladium, gold, ruthenium,rhodium, platinum, and iridium.

In the case in the first embodiment described above, the steps (h) and(i) are performed after the step (f) and before the step (g). In thecase in the second embodiment described above, the step (h) is performedafter the step (c) and before the step (d). In the step (d), thelaminated film including the Al-containing conductive film AM1, and thefirst conductor film (corresponding to the barrier conductor film BR2)over the Al-containing conductive film AM1 is patterned to form the padPD, and the step (i) is performed after the step (f) and before the step(g). In the case in the third embodiment described above, the steps (h)and (i) are performed after the step (c) and before the step (d). In thestep (d), the laminated film including the Al-containing conductive filmAM1, the first conductor film (corresponding to the barrier conductorfilm BR2) over the Al-containing conductive film AM1, and the secondconductor film (corresponding to the metal film ME1) over the firstconductor film is patterned to form the pad PD.

(About Further Modifications of First to Third Embodiments)

Herein, further modifications of the above-described first to thirdembodiments will be explained. When “the first embodiment” is referredto herein, it also includes the modifications (above described first tofourth modifications) explained in the section of “(First Embodiment)”.Moreover, when “the second embodiment” is referred to herein, it alsoincludes the modifications explained in the section of “(SecondEmbodiment)”. Moreover, when “the third embodiment” is referred toherein, it also includes the modifications explained in the section of“(Third Embodiment)”.

As already described, a titanium (Ti) film, a titanium nitride (TiN)film, a tantalum (Ta) film, a tantalum nitride (TaN) film, a tungsten(W) film, a tungsten nitride (WN) film, a titanium tungsten (TiW) film,and a tantalum tungsten (TaW) film are suitable as the barrier conductorfilm which prevents reactions with Cu in the copper wire (WA) and Al inthe Al-containing conductive film AM1. Other than them, a nickel (Ni)film and a cobalt (Co) film are also effective as the barrier conductorfilm which prevents reactions with Cu in the copper wire (WA) and Al inthe Al-containing conductive film AM1. Note that the barrier conductorfilm which prevents reactions with Cu in the copper wire (WA) and Al inthe Al-containing conductive film AM1 corresponds to the barrierconductor film formed below the metal film ME1, corresponds to theabove-described barrier conductor film BR3 in the case of the abovedescribed first embodiment, and corresponds to the above-describedbarrier conductor film BR2 in the case of the above-described second andthird embodiments.

Therefore, as further modification of the above-described firstembodiment, in the above-described first embodiment, the barrierconductor film BR3 may contain one or both of a nickel (Ni) film and acobalt (Co) film, and the barrier conductor film BR3 may be asingle-layer film composed of a nickel (Ni) film or a cobalt (Co) film.Moreover, as a further modification of the above-described secondembodiment, in the above described second embodiment, the barrierconductor film BR2 may contain one or both of a nickel (Ni) film and acobalt (Co) film, and the barrier conductor film BR2 may be asingle-layer film composed of a nickel (Ni) film or a cobalt (Co) film.Moreover, as a further modification of the above-described thirdembodiment, in the above-described third embodiment, the barrierconductor film BR2 may contain one or both of a nickel (Ni) film and acobalt (Co) film, and the barrier conductor film BR2 may be asingle-layer film composed of a nickel (Ni) film or a cobalt (Co) film.

Therefore, the barrier conductor film (corresponding to theabove-described barrier conductor film BR3 in the case of theabove-described first embodiment and corresponding to theabove-described barrier conductor film BR2 in the case of theabove-described second and third embodiments) which prevents reactionswith Cu in the copper wire (WA) and Al in the Al-containing conductivefilm AM1 may be a single-layer film or a laminated film composed of oneor more layer (s) selected from: a titanium (Ti) film, a titaniumnitride (TiN) film, a tantalum (Ta) film, a tantalum nitride (TaN) film,a tungsten (W) film, a tungsten nitride (WN) film, a titanium tungsten(TiW) film, a tantalum tungsten (TaW) film, a nickel (Ni) film, and acobalt (Co) film.

Note that, in the above-described first embodiment, as alreadydescribed, the thickness of the barrier conductor film BR3 is suitablein the range of 5 to 200 nm and is the most suitable in the range of 5to 80 nm, and the thickness of the metal film ME1 is suitable in therange of 10 to 200 nm. However, if a nickel (Ni) film, a cobalt (Co)film, or a laminated film thereof (a nickel film and a cobalt film) isemployed as the barrier conductor film BR3, the range of the preferredthickness of the barrier conductor film BR3 becomes different from therange described in the above-described first embodiment.

Specifically, if a nickel (Ni) film, a cobalt (Co) film, or a laminatedfilm thereof is employed as the barrier conductor film BR3, thethickness of the barrier conductor film BR3 is preferred to be in therange of 100 to 500 nm and is more preferred to be in the range of 250to 500 nm.

On the other hand, if a nickel (Ni) film, a cobalt (Co) film, or alaminated film thereof is employed as the barrier conductor film BR3,the thickness of the metal film ME1 can be reduced since the thicknessof the barrier conductor film BR3 is increased. Therefore, differentfrom the range described in the above-described first embodiment, thethickness of the metal film ME1 is in the range of 10 to 100 nm, inother words, 100 nm or less can be employed as an upper limit of thethickness of the metal film ME1.

If the nickel (Ni) film, the cobalt (Co) film, or a laminated filmthereof is employed as the barrier conductor film BR3, the preferredrange of the thickness of the barrier conductor film BR3 is shifted tothe larger side than the range described in the above-described firstembodiment, and this is for below reasons.

Specifically, the barrier conductor film BR3 has the function to preventreactions with Cu in the copper wire (WA) and Al in the Al-containingconductive film AM1. More specifically, the barrier conductor film BR3has the function to prevent Al constituting the Al-containing conductivefilm AM1 from diffusing to the metal-film-ME1 side (hereinafter,referred to as “Al-diffusion preventing function”), and the function toprevent Cu constituting the wire WA from diffusing to theAl-containing-conductive-film-AM1 side (hereinafter, referred to as“Cu-diffusion preventing function”). Such functions are excellent in atitanium (Ti) film, a titanium nitride (TiN) film, a tantalum (Ta) film,a tantalum nitride (TaN) film, a tungsten (W) film, a tungsten nitride(WN) film, a titanium tungsten (TiW) film, and a tantalum tungsten (TaW)film than in a nickel (Ni) film and a cobalt (Co) film.

Therefore, even in a high-temperature environment such as ahigh-temperature storage test, from the viewpoint of preventing Alconstituting the Al-containing conductive film AM1 from being reactedwith Cu constituting the copper wire as much as possible and ofimproving the reliability of the semiconductor device as much aspossible, it is advantageous to select the materials of the barrierconductor films BR3 and BR2 in the manner described in theabove-described first to third embodiments.

However, although somewhat inferior to a titanium (Ti) film, a titaniumnitride (TiN) film, a tantalum (Ta) film, a tantalum nitride (TaN) film,a tungsten (W) film, a tungsten nitride (WN) film, a titanium tungsten(TiW) film, and a tantalum tungsten (TaW) film, a nickel (Ni) film and acobalt (Co) film also have the Al-diffusion preventing function and theCu-diffusion preventing function. Therefore, the barrier conductor filmBR3 may include one or both of a nickel (Ni) film and a cobalt (Co)film, and the barrier conductor film BR3 may be a single-layer filmcomposed of a nickel (Ni) film or a cobalt (Co) film. If a nickel (Ni)film, a cobalt (Co) film, or a laminated film thereof is employed as thebarrier conductor film BR3, it is desired to somewhat increase thethickness of the barrier conductor film BR3 in order to compensate for(increase) the Al-diffusion preventing function and the Cu-diffusionpreventing function. Therefore, if a nickel (Ni) film, a cobalt (Co)film, or a laminated film thereof is employed as the barrier conductorfilm BR3, the preferred range of the thickness of the barrier conductorfilm BR3 is shifted to the larger side than the range described in theabove-described first embodiment, is specifically preferred to be in therange of 100 to 500 nm, and is more preferred to be in the range of 250to 500 nm.

Moreover, a nickel (Ni) film and a cobalt (Co) film are softer comparedwith a titanium (Ti) film, a titanium nitride (TiN) film, a tantalum(Ta) film, a tantalum nitride (TaN) film, a tungsten (W) film, atungsten nitride (WN) film, a titanium tungsten (TiW) film, and atantalum tungsten (Taw) film, and therefore readily play the role of acushion in wire bonding. Moreover, if the nickel (Ni) film, the cobalt(Co) film, or the laminated film thereof is employed as the barrierconductor film BR3, the barrier conductor film BR3 is comparativelysoft, and the thickness of the barrier conductor film BR3 is increasedas described above; therefore, the function as a cushion is furtherenhanced. When the barrier conductor film BR3 plays the role as acushion in wire bonding, even if the thickness of the metal film ME1 isreduced, failure (for example, a phenomenon in which the wire WApenetrates through the metal film ME1) does not easily occur, so thatthe thickness of the metal film ME1 can be reduced. Therefore, if anickel (Ni) film, a cobalt (Co) film, or a laminated film thereof isemployed as the barrier conductor film BR3, the thickness of the metalfilm ME1 can be reduced. For example, the upper limit of the thicknessof the metal film ME1 which is 200 nm in the above-described firstembodiment can be reduced to 100 nm or less. In this case, the thicknessof the metal film ME1 can be reduced to be smaller than the thickness ofthe barrier conductor film BR3. Since the metal film ME1 is composed ofone or more metal (s) selected from a group consisting of palladium(Pd), gold (Au), ruthenium (Ru), rhodium (Rh), platinum (Pt), andiridium (Ir), the material for the metal film ME1 is expensive, andincreasing the thickness of the metal film ME1 leads to increase in themanufacturing cost of the semiconductor device. If a nickel (Ni) film, acobalt (Co) film, or a laminated film thereof is employed as the barrierconductor film BR3, the thickness of the expensive metal film ME1 can bereduced; therefore, the manufacturing cost of the semiconductor devicecan be reduced.

Similarly, if the nickel (Ni) film, the cobalt (Co) film, or thelaminated film thereof is employed as the barrier conductor film BR2 inthe above-described second and third embodiments, the thickness of thebarrier conductor film BR2 is preferred to be in the range of 100 to 500nm and is more preferred to be in the range of 250 to 500 nm, and thethickness of the metal film ME1 is preferred to be in the range of 10 to100 nm. In this case, the thickness of the metal film ME1 can be reducedto be smaller than the thickness of the barrier conductor film BR2.

Moreover, nickel (electrical resistivity 6.99×10⁻⁸ Ωm) and cobalt(electrical resistivity 5.81×10⁻⁸ Ωm) have lower electrical resistivitycompared with palladium (electrical resistivity 1.0×10⁻⁷ Ωm). Therefore,if a nickel (Ni) film is used as the barrier conductor film formed belowthe metal film ME1 and if a palladium (Pd) film is used as the metalfilm ME1, the thickness of the barrier conductor film BR3 (nickel film)is increased, while the thickness of the metal film ME1 (palladium film)can be reduced; therefore, the electrical conductivity between the wireWA and the Al-containing conductive film AM1 can be improved. Moreover,since cobalt (Co) has lower electric resistivity than nickel (Ni), if acobalt (Co) film is used as the barrier conductor film formed below themetal film ME1, the electrical conductivity between the wire WA and theAl-containing conductive film AM1 can be further improved.

If a nickel (Ni) film, a cobalt (Co) film, or a laminated film thereofis employed as the barrier conductor film (the above-described barrierconductor film BR3 in the case of the above-described first embodiment,the above-described barrier conductor film BR2 in the case of the abovedescribed second and third embodiments) which prevents reactions with Cuin the copper wire (WA) and Al in the Al-containing conductive film AM1,it is desired to increase the thickness of the barrier conductor film asdescribed above. Even in such a case, as well as the above-describedfirst to third embodiments, the height (distance) from the upper surfaceof the Al-containing conductive film AM1 constituting the pad PD to theupper surface (surface) of the metal film ME1 formed in the opening OPof the insulating film PA is lower than the height (distance) from theupper surface (surface) of the Al-containing conductive film AM1constituting the pad PD to the upper surface (surface) of the insulatingfilm PA formed on the Al-containing conductive film AM1. In other words,also in the above-described first to third embodiments and also in thefurther modifications of the first to third embodiments explainedherein, based on the upper surface (surface) of the Al-containingconductive film AM1 constituting the pad PD, the height position of theupper surface (surface) of the metal film ME1 formed in the opening OPof the insulating film PA is lower than the height position of the uppersurface (surface) of the insulating film PA formed on the Al-containingconductive film AM1. Note that the upper surface (surface) of the metalfilm ME1 formed in the opening OP of the insulating film PA correspondsto the upper surface (surface) of the metal film ME1 formed at thebottom portion of the opening OP instead of the surface of the metalfilm ME1 formed on the lateral surface of the opening OP. In otherwords, it corresponds to the surface (ME1 a) joined with the copper wire(WA). Therefore, the upper surface (surface) of the metal film ME1formed in the opening OP of the insulating film PA is approximatelyparallel to the upper surface (surface) of the Al-containing conductivefilm AM1.

FIG. 65 is an explanatory view of a case in which a nickel (Ni) film isused as the barrier conductor film BR3 in the structure of abovedescribed FIG. 6. In the case of FIG. 65, as a result of using a nickel(Ni) film as the barrier conductor film BR3, the thickness of thebarrier conductor film BR3 is larger than that in the case of abovedescribed FIG. 6. Also in such a structure of FIG. 65, as well as theabove-described FIG. 6, the height H1 from the upper surface of theAl-containing conductive film AM1 constituting the pad PD to the uppersurface (surface) of the metal film ME1 formed in the opening OP of theinsulating film PA is lower than the height H2 from the upper surface(surface) of the Al-containing conductive film AM1 constituting the padPD to an upper surface (surface) PAa of the insulating film PA formed onthe Al-containing conductive film AM1 (in other words, H1<H2). Such aheight relation (the relation of H1<H2) is satisfied also in theabove-described first to third embodiments and also in the furthermodifications of the first to third embodiments explained herein, and itis obvious also from FIG. 6, FIG. 9, FIG. 29, FIG. 30, FIG. 32, FIG. 33,FIG. 40, FIG. 41, FIG. 42, FIG. 43, FIG. 53, FIG. 54, FIG. 65, etc.described above. Note that, in FIG. 65, in order to facilitateunderstanding, the upper surface (surface) of the insulating film PAformed on the Al-containing conductive film AM1 is shown with a signPAa. Thus, in the insulating film PA, the upper surface PAa of theinsulating film PA referred to herein corresponds to the upper surfaceof the part covering the peripheral part of the pad PD (morespecifically, the region of the pad PD in which the barrier conductorfilm BR2 referred to in FIG. 65 is formed).

Such a height relation (the relation of H1<H2) is satisfied because bothof the metal film ME1 and the barrier conductor film formed below themetal film ME1 are formed by a sputtering method. For example, in thestructure of above described FIG. 65, if one or both of the metal filmME1 and the barrier conductor film BR3 is (are) formed by a platingmethod, the height position of the upper surface (surface) of the metalfilm ME1 formed in the opening OP of the insulating film PA becomeshigher than the height position of the upper surface (surface) of theinsulating film PA formed on the Al-containing conductive film AM1;therefore, the relation of H1<H2 is not satisfied. Also in theabove-described first to third embodiments and also in the furthermodifications of the first to third embodiments explained herein, themetal film ME1 and the barrier conductor film BR3 (and the barrierconductor film BR2) are formed by a sputtering method; therefore, themetal film ME1 and the barrier conductor film BR3 (and the barrierconductor film BR2) can be formed to be thin, and the above-describedheight relation (the relation of H1<H2) can be satisfied. Therefore, aswell as the above-described first to third embodiments, also in thefurther modifications of the first to third embodiments explainedherein, a plating film is not interposed (present) between the wire WAand the Al-containing conductive film AM1.

In FIG. 65, as examples of the thicknesses of the films, the thicknessof the barrier conductor film BR1 is about 50 to 200 nm, the thicknessof the Al-containing conductive film AM1 is for example about 0.7 to 1.5μm, the thickness of the barrier conductor film BR2 is about 20 to 100nm, and the thickness of the insulating film PA is about 0.8 to 2 μm. InFIG. 65, if the barrier conductor film BR3 is composed of a nickel (Ni)film, the thickness of the barrier conductor film BR3 composed of thenickel (Ni) film is preferred to be in the range of 100 to 500 nm, ismore preferred to be in the range of 250 to 500 nm, and the thickness ofthe metal film ME1 is preferred to be in the range of 10 to 100 nm.

Next, the diffusion mechanism of Cu in aluminum (Al) and the diffusionmechanism of Ti, Ni, and Co in aluminum (Al) will be explained.

In aluminum (Al), while Cu diffuses by a hole mechanism, Ti, Ni, and Coundergo short-path diffusion along transitions. Therefore, Cu and Ti,Ni, and Co have different diffusion mechanisms in aluminum (Al), Cu is ahole mechanism, and Ti, Ni, and Co undergo transition diffusion. In thehole mechanism, the holes in crystals generated due to thermalexcitation, addition of impurities, etc. are randomly moved whileexchanging positions with adjacent atoms. In transition diffusion, atomsare diffused along the transitions which are defects in the crystals(defects that disturbance in the atomic arrangement or crystal latticesis generated along one line). Compared with the hole mechanism, in thetransition diffusion, atoms are not readily diffused, and the diffusioncoefficient of atoms becomes small.

Therefore, the diffusion coefficient in aluminum (Al) becomes aconsiderably small value in Ti, Ni, and Co compared with Cu. Therefore,all of a titanium (Ti) film, a nickel (Ni) film, and a cobalt (Co) filmcan be used as the barrier conductor film (corresponding to theabove-described barrier conductor film BR3 in the case of theabove-described first embodiment and corresponding to theabove-described barrier conductor film BR2 in the case of theabove-described second and third embodiments) which prevents reactionswith Cu in the copper wire and Al in the Al-containing conductive filmAM1.

The readiness of transition diffusion in aluminum (Al) will be describedbelow about Ti, Ni, and Co. Regarding the respective metal bonding radiiof Ni, Co, Ti, and Al, Ni is 1.25 angstrom, Co is 1.25 angstrom, Ti is1.45 angstrom, and Al is 1.43 angstrom. Note that the metal bondingradius of Cu is 1.28 angstrom. Since the metal bonding radii of Ti andAl are approximately the same, distortion energy is comparatively smalleven when transitions occur between an Al region and a Ti region. On theother hand, since the metal bonding radii of Ni and Co are considerablysmall compared with the metal bonding radius of Ti, if transitions occurbetween an Al region and a Ni region (or a Co region), distortion energybecomes large, and Ni and Co are readily diffused compared with Ti.

Therefore, in aluminum (Al), Ni and Co are readily diffused comparedwith Ti. Therefore, as the barrier conductor film (corresponding to theabove-described barrier conductor film BR3 in the case of theabove-described first embodiment and corresponding to theabove-described barrier conductor film BR2 in the case of theabove-described second and third embodiments) which prevents reactionswith Cu in the copper wire and Al in the Al-containing conductive filmAM1, a titanium (Ti) film is more advantageous than a nickel (Ni) filmor a cobalt (Co) film.

Therefore, if a nickel (Ni) film, a cobalt (Co) film, or a laminatedfilm thereof is employed as the barrier conductor film which preventsreactions with Cu in the copper wire and Al in the Al-containingconductive film AM1, it is desired to increase the thickness of thebarrier conductor film and to thereby increase (compensate for) thebarrier function. Therefore, the thickness ranges as described above(preferably 100 to 500 nm, more preferably 250 to 500 nm) are employed.

While the invention achieved by the present inventors has beenspecifically described heretofore on the basis of the embodimentsthereof, the present invention is not limited to the foregoingembodiments. It will be appreciated that various changes andmodifications can be made in the invention within the scope notdeparting from the gist thereof.

In addition, a part of the details described in the above-describedembodiments is described below.

[Additional Note 1]

A semiconductor device having:

a semiconductor chip having a pad and an insulating film having anopening exposing a part of the pad;

a copper wire electrically connected to the pad of the semiconductorchip; and

a sealing resin portion sealing the semiconductor chip and the copperwire;

wherein the pad has an Al-containing conductive film containing aluminumas a main component;

in the opening, a first laminated film having a first conductor film anda second conductor film on the first conductor film is interposedbetween the copper wire and the Al-containing conductive film, and thecopper wire is joined with the second conductor film;

the first conductor film is a single-layer film or a laminated filmcomposed of one or more layer (s) selected from a titanium film, atitanium nitride film, a tantalum film, a tantalum nitride film, atungsten film, a tungsten nitride film, a titanium tungsten film, atantalum tungsten film, a nickel film, and a cobalt film;

the second conductor film is composed of one or more metal (s) selectedfrom a group consisting of palladium, gold, ruthenium, rhodium,platinum, and iridium; and

a height from an upper surface of the Al-containing conductive film toan upper surface of the second conductor film formed in the opening islower than a height from the upper surface of the Al-containingconductive film to an upper surface of the insulating film formed on theAl-containing conductive film.

[Additional Note 2]

A method of manufacturing a semiconductor device including:

(a) a step of preparing a semiconductor substrate;

(b) a step of forming a first insulating film on a principal surface ofthe semiconductor substrate;

(c) a step of forming an Al-containing conductive film containingaluminum as a main component on the first insulating film;

(d) a step of patterning the Al-containing conductive film to form apad;

(e) a step of forming a second insulating film on the first insulatingfilm so as to cover the pad;

(f) a step of forming an opening in the second insulating film; and

(g) a step of electrically connecting a copper wire to the pad exposedfrom the opening; wherein,

after the step (c) and before the step (g),

the method further includes (h) a step of forming a first conductor filmon the Al-containing conductive film by a sputtering method;

after the step (h) and before the step (g), the method further includes(i) a step of forming a second conductor film on the first conductorfilm by a sputtering method;

the first conductor film is a single-layer film or a laminated filmcomposed of one or more layer (s) selected from a titanium film, atitanium nitride film, a tantalum film, a tantalum nitride film, atungsten film, a tungsten nitride film, a titanium tungsten film, atantalum tungsten film, a nickel film, and a cobalt film;

the second conductor film is composed of one or more metal (s) selectedfrom a group consisting of palladium, gold, ruthenium, rhodium,platinum, and iridium; and,

in the step (g), the copper wire is joined with the second conductorfilm.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: (a) providing a semiconductor substrate; (b)forming, over a main surface the semiconductor substrate, a firstinsulating film; (c) forming, over the first insulating film, anAl-containing conductive film containing aluminum as a main component;(d) patterning the Al-containing conductive film to form a pad; (e)forming, over the first insulating film, a second insulating film tocover the pad therewith; (f) forming an opening in the second insulatingfilm; (g) electrically coupling a copper wire to the pad exposed fromthe opening; (h) after the (c) and before the (g), forming a firstconductor film over the Al-containing conductive film; and (i) after the(h) and before the (g), forming a second conductor film over the firstconductor film, wherein the first conductor film includes a single-layerfilm or a laminated film including one or more layers of films selectedfrom a group consisting of a titanium film, a titanium nitride film, atantalum film, a tantalum nitride film, a tungsten film, a tungstennitride film, a titanium-tungsten film, and a tantalum-tungsten film,wherein the second conductor film comprises one or more metals selectedfrom a group consisting of palladium, gold, ruthenium, rhodium,platinum, and iridium, and wherein, in the (g), the copper wire isbonded to the second conductor film.
 2. The method of manufacturing thesemiconductor device according to claim 1, wherein, in the (i), thesecond conductor film is formed by a sputtering method.
 3. The method ofmanufacturing the semiconductor device according to claim 1, wherein thesecond conductor film comprises a palladium film.
 4. The method ofmanufacturing the semiconductor device according to claim 3, wherein thefirst conductor film comprises a titanium film.
 5. The method ofmanufacturing the semiconductor device according to claim 4, wherein, inthe (h), the first conductor film is formed by a sputtering method. 6.The method of manufacturing the semiconductor device according to claim1, wherein the (h) and the (i) are performed after the (f) and beforethe (g).
 7. The method of manufacturing the semiconductor deviceaccording to claim 1, wherein the (h) is performed after the (c) andbefore the (d), wherein, in the (d), a laminated film including theAl-containing conductive film, and the first conductor film over theAl-containing conductive film are patterned to form the pad, and whereinthe (i) is performed after the (f) and before the (g).
 8. The method ofmanufacturing a semiconductor device according to claim 1, wherein the(h) and the (i) are performed after the (c) and before the (d), andwherein, in the (d), a laminated film including the Al-containingconductive film, the first conductor film over the Al-containingconductive film, and the second conductor film over the first conductorfilm are patterned to form the pad.